tag: Siemens EDA

Challenges In Using Sub-7nm ICs In Automotive
By Laura Peters - 10 Jun, 2025 - Comments: 0

The automotive industry is producing vehicles with increasing levels of real-time decision-making, enabled by thousands of ICs, sensors, and multi-chip packages, but making sure these systems work flawlessly throughout their expected lifetimes is a growing challenge. Automotive chips traditionally were developed at mature process nodes in five- to seven-year cycles, but much has changed over... » read more

Rethinking Chip Reliability For Harsh Conditions
By Gregory Haley - 10 Jun, 2025 - Comments: 0

As semiconductors push into environments once considered untenable, reliability expectations are being redefined. From the vacuum of space and the inside of jet engines to deep industrial automation and electrified drivetrains, chips now must endure extreme temperature swings, corrosive atmospheres, mechanical vibration, radiation, and unpredictable power cycles, all while delivering increasing... » read more

Accelerated Assurance For Functional Safety
By Jake Wiltgen - 05 Jun, 2025 - Comments: 0

Today’s electronic systems face unprecedented challenges in ensuring functional safety. As autonomous vehicles navigate our streets, medical devices sustain lives, and industrial automation systems control critical processes, the need for robust safety processes and supporting automation has never been more crucial. The complexity of modern electronic systems, coupled with stringent safety st... » read more

AR/VR Glasses Taking Shape With New Chips
By Liz Allan - 05 Jun, 2025 - Comments: 0

More augmented reality (AR), virtual reality (VR), and mixed reality (MR) wearables are coming, but how they are connected, and where image and other data is processed, are still in flux. Ray-Ban Meta AI glasses, for example, look like classic eyeglasses, but they rely on a tethered smart phone for such functions as taking pictures, AI voice assistance, and object identification. In contrast... » read more

Blog Review: June 4
By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

Connecting AI Accelerators
By Ann Mutschler - 04 Jun, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering sat down to discuss the various ways that AI accelerators are being applied today with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; Alexander Petr, senior director at Keysight; Steve Roddy, chief marketing office... » read more

Addressing Stress In Heterogeneous 3D-IC Designs
By Shetha Nolke - 29 May, 2025 - Comments: 0

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new challenges that must be carefully navigated. As chip designers integrate multiple dies and technologies into a single 3D package, the interactions between the chip and package become increasingly co... » read more

Optimizing Data Movement
By Ann Mutschler - 29 May, 2025 - Comments: 1

Demand for new and better AI models is creating an insatiable demand for more processing power and much better data throughput, but it's also creating a slew of new challenges for which there are not always good solutions. The key here is figuring out where bottlenecks might crop up in complex chips and advanced packages. This involves a clear understanding of how much bandwidth is required ... » read more

Executive Outlook: Chiplets, 3D-ICs, and AI
By Ed Sperling - 29 May, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product ... » read more

Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
By Siemens EDA - 29 May, 2025 - Comments: 0

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also introduces new complexities that can influence chip warpage and circuit behavior due to thermo-mechanical stress impacts. In heterogeneous 3D IC architectures, the interaction between the chips ... » read more

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