tag: Siemens

Built-In Security For Auto Chips
By Jeff Dorsch - 11 Apr, 2018 - Comments: 0

The road to autonomous vehicles depends upon components that are secured against hacking and other outside interference. The cybersecurity precautions necessary for self-driving cars must be embedded in chips and systems from the beginning of the supply chain. Automotive manufacturers and their Tier 1 suppliers are counting on their electronics vendors to provide products that can withst... » read more

New Market Drivers
By Brian Bailey - 11 Apr, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohammed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techn... » read more

Blog Review: Apr. 11
By Jesse Allen - 11 Apr, 2018 - Comments: 0

Mentor's Dennis Brophy looks at how the black box nature of IP means it's hard to tell if a block is free from security risks, even if verification IP and open-source design code can help. Synopsys' Sri Deepti Pisipati explains Panel Self Refresh, a power saving mechanism in Display Port that allows for turning off the video processor and its circuitry when an image is static. Cadence's P... » read more

The Race To Mass Customization
By Ed Sperling - 09 Apr, 2018 - Comments: 0

The number of advanced packaging options continues to rise. The choices now include different materials for interposers, at least a half-dozen fan-outs, not to mention hybrid fan-out/3D stacking, system-in-package, flip-chip and die-to-die bridges. There are several reasons for all of this activity. First, advanced packaging offers big improvements in performance and power that cannot be ac... » read more

Embedded Die Packaging Emerges
By Mark LaPedus - 09 Apr, 2018 - Comments: 1

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

Functional Safety In AI-Controlled Vehicles
By Mentor, a Siemens Business - 09 Apr, 2018 - Comments: 0

Whereas ISO 26262 specifies requirements for eliminating safety hazards in the presence of an E/E system fault, this paper explains why new standards for the AI era must address so-called safety of the intended functionality (SOTIF), which means helping to validate that advanced automotive functionalities are engineered into the vehicle to avoid safety hazards even in the absence of a fault. ... » read more

The Week In Review: Design
By Jesse Allen - 06 Apr, 2018 - Comments: 0

Tools Mentor, a Siemens business, filled in the last of the hardware configurations for its Veloce Strato emulation family, creating a full upgrade path. Users can initially purchase only the hardware that they need (StratoTiL) and if later they require more capacity (StratoTi) or the ability to handle larger designs (StratoT), they can incrementally add the necessary hardware to their existin... » read more

Addressing The Productivity Gaps In IIoT
By Scot Morrison - 05 Apr, 2018 - Comments: 0

The Industrial Internet of Things (IIoT) can be enabled by many different topologies and permutations of underlying infrastructure, but the one constant is that it brings new levels of profitability, efficiency, and productivity to businesses and industries near and far. The IIoT is enabled by connectivity from device to device, and device to and from the cloud. However, it’s not only abou... » read more

Where Is Energy Harvesting?
By Kevin Fogarty - 05 Apr, 2018 - Comments: 0

With power management a top priority in sensor networks, why is energy harvesting—a proven technology with diverse energy sources—conspicuously absent from sensor designs that are the foundation of the Internet of Things? [getkc id="165" kc_name="Energy harvesting"] always has been a promising answer to the limits of battery power. The idea that a device can run for much longer periods o... » read more

New Market Drivers
By Brian Bailey - 05 Apr, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohamed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techno... » read more

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