The Week In Review: Design/IoT

By Jesse Allen - 13 Mar, 2015 - Comments: 0

Mergers & Acquisitions NXP added to its list of recent acquisitions with Athena SCS, a UK-based provider of embedded software and cryptography for smart cards and NFC. Lattice Semiconductor closed its all-cash $606.6 million acquisition of Silicon Image. Tools Cadence unveiled the Innovus Implementation System. The physical implementation tool sports massively parallel architect... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 30 Jan, 2015 - Comments: 0

This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

The Week In Review: Design/IoT

By Ed Sperling - 30 Jan, 2015 - Comments: 0

Mergers/Acquisitions Lattice Semiconductor agreed to pay $600 million for Silicon Image, which makes connectivity solutions for high-definition content for mobile and consumer electronics. Lattice already makes programmable connectivity solutions, so the combined IP portfolio is expected to strengthen its position in wired and wireless markets. Tools Cadence expanded the tool portfolio it ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

New Low-Power Memory Interface Ahead

By Ed Sperling - 12 Aug, 2010 - Comments: 0

By Pallab Chatterjee The trend in consumer electronic devices is toward a multimedia-centric data flow, forcing changes in the memory interface needed to handle it. The increased compute resources needed for video signal processing, along with high-definition audio, used to be the exclusive domain of mainstream desktop computers and servers due to their access to memory and high data throug... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Silicon Image

The Week In Review: Design/IoT

The Week In Review: Manufacturing

The Week In Review: Design/IoT

The Week In Review: Manufacturing

New Low-Power Memory Interface Ahead