Streamlining Functional Verification For Multi-Die And Chiplet Designs

By Cadence - 30 Jul, 2025 - Comments: 0

An Opportunity and a Challenge The manufacturing aspects of multi-die/multi-chiplet designs are often highlighted, but what about verification? Functional correctness and performance of inter-die connections via a standard interface, such as UCIe or a custom inter-die interface, are not guaranteed to meet all system requirements. These interfaces must be verified comprehensively, ensuring co... » read more

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Streamlining Functional Verification For Multi-Die And Chiplet Designs

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