New Issues In Advanced Packaging

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Signal Integrity’s Growing Complexity

By Matt Elmore While in the market for a memory upgrade recently, I was surprised by the availability of commercial DDR memories. You can get 8GB of DDR3 memory, transferring 17GB/s, relatively inexpensively. The progress in memory design is outstanding. From smartphones to gaming PCs, quick communication between the IC and off-chip memory is key to enabling the performance we demand in the... » read more