3D NAND Market Heats Up


After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

The Week In Review: Manufacturing


IBM continues to cut jobs, according to IEEE Spectrum and an IBM employee organization. Meanwhile, IBM and SUNY Polytechnic Institute announced that more than 220 engineers and scientists who lead IBM's advanced chip R&D efforts at SUNY Poly's Albany Nanotech campus will become part of IBM Research. While military applications continue to experience strong growth in RF gallium-nitride (GaN)... » read more

The Week In Review: Manufacturing


This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

Manufacturing And Packaging Changes For 2015


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Solid Years: Cautious Optimism Drives Equipment Spending Into 2015


Worldwide semiconductor capital expenditure growth for this year is expected to be 11% and will increase another 8% in 2015. Throughout 2014, SEMI has tracked 177 facilities worldwide investing about US$34 billion on semiconductor equipment. In 2015, 190 facilities are being tracked with fab equipment spending worth over $40 billion. The double-digit growth in fab equipment spending for this ye... » read more

Hybrid Memory Cube – Ready For Prime Time


With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

The Week In Review: Manufacturing


Tesla Motors plans to build a new 35-GWh, lithium-ion cell production facility for its electric vehicles. It sounds like a good idea. But the factory will bring about only a modest reduction in battery costs, and could create significant overcapacity in the arena, according to Lux Research. “The Gigafactory will only reduce the Tesla Model 3’s cost by $2,800, not enough to sway the success ... » read more

Different Approaches Emerge For Stacking Die


The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

Ion Implanter Market Heats Up


The ion implanter market has been a stable, if not a sleepy, business. The last big event took place in 2011, when Applied Materials re-entered the ion implanter market by acquiring Varian, the world’s leading supplier of these tools. The acquisition gave Applied Materials a commanding 80% share of the implanter business, with the other players fighting for the crumbs. But after year... » read more

What’s Next For Memory?


Apple, Samsung and others are developing the next wave of smartphones and tablets. OEMs want to integrate new memory schemes that provide more bandwidth at lower power. But there are some challenges in the arena that are prompting memory makers to rethink their mobile DRAM roadmaps. The conventional wisdom was that memory makers would ship mobile DRAMs based on the new LPDDR4 interface stand... » read more

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