Challenges For A Post-Moore’s Law World


Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Week In Review: Manufacturing, Test


Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

Week in Review: Iot, Security, Automotive


IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Big Push For 3D Sensing With iPhone X


3D sensing is a buzzword that has been thrown around quite a bit this year in connection with the rumors surrounding the tenth-anniversary iPhone. Although the iPhone X will be the first large-scale consumer push for 3D sensing, the technology has been around for years, particularly in industrial applications such as machine vision. 3D sensing is already used in the PC – think Intel’s RealS... » read more

Experts At The Table: What’s Missing In The IoT


Semiconductor Engineering sat down to discuss the future of the IoT with Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division; Martin Lund, senior vice president of the IP Group at Cadence; Naveed Sherwani, president and CEO of Open-Silicon; and Damon Hernandez, a member of the Web3D Consortium. What follows are excerpts of that conver... » read more

SOI Highlights at Common Platform Tech Forum


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

ST-Ericsson 28nm FD-SOI/ARM Chip Hits 2.8GHz at CES


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ What a great start to 2013: at CES in Las Vegas, ST-Ericsson announced the NovaThor™ L8580 ModAp, “the world’s fastest and lowest-power integrated LTE smartphone platform.” This is the one that’s on STMicroelectronics’ 28nm FD-SOI, with sampling set for Q1 2013. And it’s a game changer – for users, fo... » read more

ST’s FD-SOI Tech Available to All Through GF


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In the spring of 2012, STMicroelectronics announced the company would be manufacturing ST-Ericsson’s next-generation (and very successful) NovaThor ARM-based smartphone/tablet processors using 28nm FD-SOI process technology. With first samples coming out this fall, ASN talks to Jean-Marc Chery, Executive Vice Pres... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA


The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

Power And Performance: GSS Sees SOI Advantages For FinFETs


Are FinFETs better on SOI? In a series of papers, high-profile blogs and subsequent media coverage,Gold Standard Simulations (aka GSS) has indicated that, yes, FinFETs should indeed be better on SOI. To those of us not deeply involved in the research world, much of this may seem to come out of nowhere.  But there’s a lot of history here, and in this blog we’ll take a look at what it’s... » read more

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