Transforming AppSec: The Top Three Ways To Build Security Into DevOps


DevOps has changed the way organizations bring software to market, allowing them to deliver new applications and features rapidly and continuously. But it’s also introduced new security challenges as testing and remediation have failed to keep pace. As a result, cybercriminals have developed new attack strategies that intensify their focus on the application layer, including open source and s... » read more

Blog Review: Aug. 3


Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Need Design Talent? Create a Contest


Amid a labor crunch for qualified engineers, semiconductor ecosystem participants are coming up with new strategies to entice university students, such as design competitions. In one design competition sponsored by Renesas earlier this year for European university students and their educators, teams were tasked with building a self-guided robot that could drive along a track in a virtual sim... » read more

Customizing Processors


The design, verification, and implementation of a processor is the core competence of some companies, but others just want to whip up a small processor as quickly and cheaply as possible. What tools and options exist? Processors range from very small, simple cores that are deeply embedded into products to those operating at the highest possible clock speeds and throughputs in data centers. I... » read more

Distilling The Essence Of Four DAC Keynotes


Chip design and verification are facing a growing number of challenges. How they will be solved — particularly with the addition of machine learning — is a major question for the EDA industry, and it was a common theme among four keynote speakers at this month's Design Automation Conference. DAC has returned as a live event, and this year's keynotes involved the leaders of a systems comp... » read more

TCAD-Based Radiation Modeling Technique For Reliable Aerospace Chips


By Ian Land and Ricardo Borges We demand a lot from the electronic components that bring our devices and systems to life. This is particularly true when it comes to semiconductors for space applications. From satellites to spacecraft, aerospace and defense equipment must tolerate the most extreme of operating conditions in order to perform their jobs safely and reliably. How do you ensure... » read more

Custom Compiler Technology Highlights from 2022.06 Release


Weikai Sun, VP of Engineering at Synopsys, highlights the key technologies in Custom Compiler’s latest release. He shows how Synopsys’ innovative solutions for design closure, layout automation and emerging applications are increasing the productivity of design teams. Click here to access the  video white paper. » read more

Blog Review: July 27


Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Near-Threshold Computing Gets A Boost


Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has been an essential technique for applications with the lowest power consumption, it always has been difficult to use. That is changing, and while it is unlikely to become a mainstream technique, it is certainly bec... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

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