tag: Synopsys

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Meeting Processor Performance And Safety Requirements For New ADAS & Autonomous Vehicle Systems
By Fergus Casey - 02 Dec, 2021 - Comments: 1

By Fergus Casey and Srini Krishnaswami Innovation in today’s automotive industry is accelerating as companies race to be the market leader in safety and autonomous vehicles. With vehicle control moving from humans to the vehicles’ active safety systems, more sensors – cameras, radar, lidar, etc. – are being added to automotive systems. More sensors require more computational performa... » read more

Will Markets For ML Models Materialize?
By Bryon Moyer - 02 Dec, 2021 - Comments: 0

Developers are spending increasing amounts of time and effort in creating machine-learning (ML) models for use in a wide variety of applications. While this will continue as the market matures, at some point some of these efforts might be seen as reinventing models over and over. Will developers of successful models ever have a marketplace in which they can sell those models as IP to other d... » read more

Blog Review: Dec. 1
By Jesse Allen - 01 Dec, 2021 - Comments: 0

Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Securing Connected Medical Devices For FDA Submissions
By Synopsys - 01 Dec, 2021 - Comments: 0

The benefits and challenges of the Internet of Things (IoT) are especially evident in healthcare, thanks to increases in the volume and use of medical devices. Network-connected devices have greatly improved patient care by helping healthcare providers monitor vital signs, regulate medication dosages, improve diagnostics, and ultimately improve patient outcomes while lowering costs. This whi... » read more

Missing Interposer Abstractions And Standards
By Brian Bailey - 29 Nov, 2021 - Comments: 0

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

Blog Review: Nov. 24
By Jesse Allen - 24 Nov, 2021 - Comments: 0

Cadence's Paul McLellan introduces the theory and practice of datapath formal verification and explores two use cases of dot-product accumulate systolic design and hashing design. Siemens EDA's Rich Edelman shows that constructing an in-order UVM scoreboard doesn't have to be a difficult or complex task, and certainly simpler than replacing a laptop's keyboard. Synopsys' Gordon Cooper con... » read more

Product Lifecycle Management For Semiconductors
By Brian Bailey - 23 Nov, 2021 - Comments: 1

Product lifecycle management (PLM) and the semiconductor industry have always been separate, but pressure is growing to integrate them. Automotive, IIoT, medical, and other industries see that as the only way to manage many aspects of their business, and as it stands, semiconductors are a large black box in that methodology. The technology space is driven by a mix of top down and bottom-up p... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

Eliminating Software Development Bottlenecks For SoCs
By Sam Tennent - 23 Nov, 2021 - Comments: 0

System on chip (SoC) devices, by definition, use a combination of hardware and embedded software to provide their specified functionality. Both the design and programming teams face many challenges and have huge tasks. No matter how well they may perform, the full system cannot be verified and validated until the hardware and software are brought together in the bring-up lab. This is usually wa... » read more

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