Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)


A new technical paper titled "Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity" was published by researchers at Arizona State University and University of Minnesota. Abstract: "The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction... » read more