Intel/GF deal: Pros, Cons, Unknowns

By Mark LaPedus - 22 Jul, 2021 - Comments: 1

The industry is still buzzing over a Wall Street Journal report that Intel is in talks to acquire GlobalFoundries (GF) for $30 billion. It’s been a week since the report appeared. Intel is still mum. GF says there are no talks taking place. Regardless, it’s worth looking at all of the possible scenarios just in case, and the pros and cons involved. There are layers upon layers of iron... » read more

Creating A Roadmap For Hardware Security

By Kevin Fogarty and Ed Sperling - 02 May, 2019 - Comments: 0

The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

A Crisis In DoD’s Trusted Foundry Program?

By Mark LaPedus - 22 Oct, 2018 - Comments: 0

The U.S. Department of Defense’s Trusted Foundry program is in flux due to GlobalFoundries’ recent decision to put 7nm on hold, raising national security concerns across the U.S. defense community. U.S. DoD and military/aerospace chip customers currently have access to U.S.-based “secure” foundry capacity down to 14nm, but that's where it ends. No other foundries provide similar “s... » read more

Manufacturing Bits: Feb. 6

By Mark LaPedus - 06 Feb, 2018 - Comments: 0

GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Trusted Foundry

Intel/GF deal: Pros, Cons, Unknowns

Creating A Roadmap For Hardware Security

A Crisis In DoD’s Trusted Foundry Program?

Manufacturing Bits: Feb. 6