tag: TSMC

This Is What 450mm Wafers Look Like
By SEMI - 14 Aug, 2014 - Comments: 0

The first fully patterned 450mm wafers were on display at SEMICON West 2014 in South Hall and also showcased in the 450mm Technology Development Session. Fully patterned 450mm wafers produced using Molecular Imprints’ Imprio nanoimprint lithography (NIL) tool have been shown before (including at SEMI ISS meeting in January 2013). However, the 450mm wafers on display at SEMICON West were produ... » read more

FinFET Ramp: Changing Market Dynamics?
By Joanne Itow - 14 Aug, 2014 - Comments: 1

Rolling out a new semiconductor technology always has its share of challenges, but it seems like the 14nm finFET process node is starting off with more than its share of delays and speculation. This week Intel revealed some of the details for its new microarchitecture, Broadwell, and their first product, the Intel Core M processor, to be manufactured using their second-generation finFET, 14... » read more

Who’s Winning The FinFET Foundry Race?
By Mark LaPedus - 14 Aug, 2014 - Comments: 5

The leading-edge foundry business is challenging. For starters, foundry vendors require vast resources, gigantic fabs and lots of know-how. And yet, it’s still difficult to make money in this business. That has certainly proven to be the case in the planar transistor era, but the challenges and costs are escalating as foundry vendors begin to ramp up finFET technologies at the 16nm/14nm no... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Aug, 2014 - Comments: 0

Many are suffering from “fragiphoniphobia” without even realizing it, according to Kyocera. This is the fear of fragile phones and worries about the drops and spills ruining our smartphones and disrupting our lives. A recent survey from comScore revealed that 73% of consumers surveyed rated drop protection or scratch-proof/shatter-proof screens as the most desirable durability feature, whil... » read more

Foundries Versus OSATs
By Ed Sperling - 24 Jul, 2014 - Comments: 2

Since the 1990s, commercial foundries have ruled semiconductor manufacturing while the [getkc id='83' comment='OSAT'] providers (OSATs) have dominated IC packaging and testing. But as the industry moves toward stacked die over the next couple of years, and big foundries see a chance to expand their reach, the stage is set for an all-out war. There is much at stake on both sides. Foundries g... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Jul, 2014 - Comments: 0

IBM’s move to sell its chip business to GlobalFoundries may have stalled or is dead, according to the Albany Times Union and other news outlets. New York Governor Andrew Cuomo announced that the state will partner with over 100 private companies, led by GE, to launch the New York Power Electronics Manufacturing Consortium. GE will be a lead partner in a fab, housed at the CNSE Nano Tech co... » read more

What Happened To 450mm?
By The SE Staff - 17 Jul, 2014 - Comments: 1

By Mark LaPedus, Ed Sperling & Katherine Derbyshire There was a time not very long ago—one process node, in fact—when the economic momentum of Moore’s Law seemed unstoppable with a combination of extreme ultraviolet lithography, larger wafer sizes and a variety of new materials. Shrinking feature sizes is still technically possible, but certainly not with the same promised economic benef... » read more

Mid-Year Market Review: A Tale Of Two Halves
By Jim Feldhan - 17 Jul, 2014 - Comments: 0

The month of July brings 110-degree weather to Phoenix and a welcome trip to San Francisco for Semicon West. It also means the year is half over and it’s time to assess mid-year market dynamics. Spirits were high last week at Semicon West. Most equipment vendors made significant revenue gains in the first half of 2014 and expect the second half of the year to be just as good or even bette... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Jul, 2014 - Comments: 0

As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

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