tag: TSMC

The Week In Review: Manufacturing & Design
By Mark LaPedus - 15 Nov, 2013 - Comments: 0

Gartner says the natural life cycle of a technology-driven company is less than 10 years. “To compete in this environment, business leaders must destroy and rebuild the very businesses they helped create,” said Steve Prentice, vice president and Gartner Fellow. He cited examples of IBM Personal Systems Group, Nokia, MySpace, Kodak, Borders, HMV and other companies that have struggled or eve... » read more

The Week in Review: System-Level Design
By Ed Sperling - 15 Nov, 2013 - Comments: 0

Cadence unveiled its next-gen power signoff tool, this one based upon parallel execution across multiple processors. The result is 10x speed improvement, according to the company. The signoff solution already is certified for TSMC’s 16nm finFET process for IR drop analysis and EM rule compliance, two of the big concerns with finFETs. Synopsys teamed up with CEVA to improve PPA for CEVA’s... » read more

IP Ecosystem Solutions For Complex Systems
By Joanne Itow - 14 Nov, 2013 - Comments: 0

At the Semico Impact Conference: Focus on the IP Ecosystem, Mahesh Tirupattur, Executive Vice President, Analog Bits, challenged four panelists to an engaging discussion on their approach to IP Ecosystem Solutions for Complex Systems. Panel participants included Dan Kochpatcharin, Deputy Director, IP Portfolio Management, TSMC; Jason Polychronopoulos, Mentor Graphics; Chris Rowen, Cadence Fello... » read more

From DFM To IFM
By Ed Sperling - 14 Nov, 2013 - Comments: 0

For the past decade the bridge between design and manufacturing was called, appropriately enough, design for manufacturing. DFM tools, which by nature cross boundaries of what previously were discrete segments in the semiconductor flow, are now critical for complex designs. They allow design teams to check early in the design process whether chips will yield sufficiently and to incorporate rule... » read more

ARMing Intel
By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, the industry has kept a close eye on Intel’s fledging foundry business. The question is whether Intel will merely dabble in the foundry business or become a major player. The answer? It’s still too early to tell. Not long ago, Intel entered the foundry business and announced a smattering of small and niche-oriented customers, such as Achronix, Netronome and Tabula.  Micro... » read more

Paving The Way To 16/14nm
By Ed Sperling - 07 Nov, 2013 - Comments: 0

The move to the next stop on the Moore’s Law road map isn’t getting any less expensive or easier, but it is becoming more predictable. Tools and programs are being expanded to address physical effects such as electrostatic discharge (ESD), electromigration and thermal effects from increased current density. Any or all of these three checklist items can affect the reliability of a chip. A... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 01 Nov, 2013 - Comments: 0

Silver surfers represent a more important technology market than “Generation X” and “Generation Y,” according to research from Gartner. Silver surfers are people in middle age or approaching old age. Although most technologists fail to recognize this fact, they are very interested in using technology and also have the time and the resources to pursue their interests, according to Gartne... » read more

The Week In Review: System-Level Design
By Ed Sperling - 01 Nov, 2013 - Comments: 0

Qualcomm bought some of Arteris’ IP assets and the bulk of its French design team, but Arteris remains a viable company with a NoC product, customers, and an infrastructure. ARM released a study, in conjunction with the Economist Intelligence Unit, that shows 75% of global business leaders are actively researching opportunities on the Internet of Things. The report says the five barriers f... » read more

Uncertainty Increases About What’s Next
By Ed Sperling - 24 Oct, 2013 - Comments: 0

Across the semiconductor industry, there is a lot of talk about what’s next. Lithography advances have stalled, NRE and mask costs are rising, and complexity is exploding. But unlike the 1 micron wall, which was supposed to be impenetrable, there is no single issue holding back progress. Instead, there are lots of them, most with pricey workarounds, but which together become more complicat... » read more

Trending Back To ASICs
By Ann Mutschler - 24 Oct, 2013 - Comments: 0

True to its cyclical nature, the semiconductor industry is swinging back toward ASICs from more diversified approaches such as FPGAs. This dynamic is evident at companies such as Apple. “At one point we thought Apple was being a contrarian,” said Drew Wingard, CTO at Sonics. “Everybody else on the systems side was shedding their silicon people. The easiest counterpoint to what Apple wa... » read more

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