The Week In Review: Oct. 18


By Mark LaPedus & Ed Sperling The problems continue with extreme ultraviolet (EUV) lithography. ASML promised to deliver an 80 Watt power source by year’s end. Now, the company said it only will have a 70 Watt source by mid-2014. “We are focusing on reaching the 70 Watts by the middle of next year,” said Peter Wennink, ASML’s CEO, in a conference call to discuss the company’s res... » read more

Approaching IP Quality From Many Angles


As SoC design complexity has increased, semiconductor design IP and the industry around it has grown in its level of sophistication. This is great news for the users of that IP whose demands for quality, reliability and other deliverables have also been on the rise. Making sure users have what they need requires close collaboration between the semiconductor foundries, IP providers and of cou... » read more

Multi-Beam Begins To Shine


After years of R&D and promises, multi-beam electron-beam technology is delayed and late to the market. The technology requires more funding and work than previously thought. And generally, the skepticism is running high for the technology. Finally, however, there is a ray of hope, and some momentum, in multi-beam—at least on the photomask front. Seeking to accelerate its multi-beam te... » read more

Debate Heats Up Over Bigger Glass


For more than two decades, photomask makers have been talking about moving to a new and larger mask size, sometimes called “bigger glass” by the industry. Generally, the discussions about “bigger glass” have been all talk and no action. But now, some chipmakers are turning up the volume in the discussions and are pushing for a larger mask size. A larger mask size would require the ph... » read more

Inside Japan: The Applied Materials-Tokyo Electron Merger


The merger of Tokyo Electron and Applied Materials has turned heads around the globe, but behind the scenes in Japan there was a recognition that this deal had to be done now or it would never be possible. Releases from both companies describe it as a merger of equals, and the Japanese press has reported it that way. But international media outside of Japan take the view that Tokyo Electron ... » read more

Experts At The Table: How To Improve IP Quality


Semiconductor Engineering sat down to discuss the best ways to improve the quality of design IP with Piyush Sancheti, vice president of product marketing at Atrenta; Chris Rowen, Cadence Fellow and former CTO at Tensilica; Gene Matter, senior applications manager at Docea Power; Warren Savage, president and CEO of IPextreme; and Dan Kochpatcharin, deputy director of IP portfolio marketing at TS... » read more

Experts At The Table: How To Improve IP Quality


By Ann Steffora Mutschler Semiconductor Engineering sat down to discuss the best ways to improve the quality of design IP with Piyush Sancheti, vice president of product marketing at Atrenta; Chris Rowen, Cadence Fellow and former CTO at Tensilica; Gene Matter, senior applications manager at Docea Power; Warren Savage, president and CEO of IPextreme; and Dan Kochpatcharin, deputy director of ... » read more

Semicon West Lithography Report


OK, I have to admit this right off:  I didn’t go to Semicon West (held two weeks ago in San Francisco).  I try never to go to Semicon West (I’ve been twice in the last 30 years, both times against my will).  Why should I go?  To listen to the latest marketing messages and company spin?  To see a few technical talks that are way too light on the technical, but still full of talk?  I do... » read more

The Week In Review: Sept. 27


By Ed Sperling Applied Materials shook up the equipment market, announcing a deal to buy Tokyo Electron for about $9.3 billion in stock. The combination of No. 2 Applied and No. 3 TEL in that market equals a new No. 1, surpassing Dutch giant ASML in terms of revenue. Mentor Graphics rolled out a new versiion of its computational fluid dynamics product, adding Monte Carlo radiation modeling... » read more

Time To Think


The semiconductor industry seems to be running place these days—maybe even sprinting in place. At the leading edge of design, companies are still looking at the ramifications of moving to finFETs. The move to a 20nm process with double patterning on 16/14nm finFETs, depending on the foundry, looks like a fairly safe bet for those companies with the volume and the resources to design and de... » read more

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