tag: TSMC

Experts At The Table: How To Improve IP Quality
By Ann Mutschler - 26 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler Semiconductor Engineering sat down to discuss the best ways to improve the quality of design IP with Piyush Sancheti, vice president of product marketing at Atrenta; Chris Rowen, Cadence Fellow and former CTO at Tensilica; Gene Matter, senior applications manager at Docea Power; Warren Savage, president and CEO of IPextreme; and Dan Kochpatcharin, deputy director of I... » read more

Applied To Buy TEL
By Mark LaPedus - 24 Sep, 2013 - Comments: 0

In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%.  The combined entities will have a new name, dual headquarter... » read more

The Week In Review: Sept. 23
By Mark LaPedus - 23 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

The Week In Review: Sept. 20
By Ed Sperling - 20 Sep, 2013 - Comments: 0

By Ed Sperling It’s reference flow update time as TSMC prepares to roll out both finFETs and stacked die capabilities, and advanced capabilities at 20nm. The foundry updated its reference flows to include tools and IP from all of the Big Three EDA companies. It added Mentor Graphics’ place and route and DFM tools in its 16nm finFET reference flow, and added a slew of Mentor tools, inclu... » read more

Litho Roadmap Remains Cloudy
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

MRAM Begins To Attract Attention
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus In the 1980s, there were two separate innovations that changed the landscape in a pair of related fields—nonvolatile memory and storage. In one effort, Toshiba invented the flash memory, thereby leading to NAND and NOR devices. On another front, physicists discovered the giant magnetoresistance (GMR) effect, a technology that forms the basis of hard disk drives, magnetores... » read more

The Week In Review: Sept. 13
By Ed Sperling - 13 Sep, 2013 - Comments: 0

By Ed Sperling Cadence unveiled its next-generation emulation platform, greatly boosting the speed by up to 60x for embedded OS verification and by up to 10x for hardware/software verification. Overall, Cadence says the platform doubles verification productivity with a capacity of up to 2.3 billion gates. Cadence also reported that its mixed-signal LP flow allowed Silicon Labs to cut its MCU p... » read more

China Foundries Seek Niches
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus For decades, China has launched several initiatives to modernize its semiconductor industry with hopes of becoming the next IC powerhouse in Asia. In 2001, for example, China unveiled its so-called "Tenth Five-Year Plan," which called for the nation to build 25 new fabs from 2001 to 2005. At the time, the Chinese government hoped to start and fund a new crop of domestic fou... » read more

3D IC Supply Chain: Still Under Construction
By Barbara Jorgensen - 25 Jul, 2013 - Comments: 1

By Barbara Jorgensen and Ed Sperling Stacked die, which promise high levels of integration, a tiny footprint, energy conservation and blinding speed, still have some big hurdles to overcome. Cost, packaging and manufacturability continue to make steady progress, with test chips being produced by all of the major foundries. But in a disaggregated ecosystem, the supply chain remains a big st... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

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