tag: TSMC

Fab Investment Increases In China
By Mark LaPedus - 02 Jun, 2016 - Comments: 1

By Mark LaPedus & Ed Sperling Fab construction in China is heating up, driven by real and projected demand for IoT devices and the government's push for internally manufactured chips. [getentity id="22819" comment="GlobalFoundries"], UMC and [getentity id="22586" comment="TSMC"] are all actively building up fab capacity inside of China, usually in conjunction with other local governme... » read more

IoT Designs Evolving
By Ed Sperling - 02 Jun, 2016 - Comments: 0

IoT hardware is beginning to take shape across a variety of vertical markets, and devices are looking far different from the initial concepts. They're smarter, more targeted, and in most cases custom-built for specific applications. The concept of connected things is hardly a new one. Students at Carnegie Mellon University added sensors into a vending machine in the early 1980s to remotely m... » read more

The Week In Review: Design
By Jesse Allen - 20 May, 2016 - Comments: 1

Acquisitions ARM acquired embedded computer vision and imaging technology company [getentity id="22917" comment="Apical"] for $350 million in cash. According to ARM, the company's technology has been utilized in more than 1.5 billion smartphones and in about 300 million other consumer and industrial devices. Synopsys acquired [getentity id="22916" comment="Simpleware"], a provider of soft... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

What Happened To DSA?
By Mark LaPedus - 19 May, 2016 - Comments: 2

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

The Evolving Thermal Landscape
By Ann Mutschler - 16 May, 2016 - Comments: 0

Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more

Power-Centric Chip Architectures
By Ed Sperling - 12 May, 2016 - Comments: 0

As traditional scaling runs out of steam, new chip architectures are emerging with power as the starting point. While this trend has been unfolding for some time, it is getting an extra boost and sense of urgency as design teams weigh a growing number of design challenges and options across a variety of new markets. Among the options are [getkc id="196" kc_name="multi-patterning"] and [getkc... » read more

IP Business Models In Flux
By Ann Mutschler - 12 May, 2016 - Comments: 0

EDA and IP suppliers are engaging with foundries earlier with each manufacturing process node, while those foundries are providing ever more optimized and tuned processes to their customers. As part of this, IP providers must port their IP offerings to the various foundries and processes, putting a squeeze on resources. That raises some difficult questions, such as how to prioritize their li... » read more

Why This Roadmap Matters
By Ed Sperling - 05 May, 2016 - Comments: 0

The semiconductor industry is now officially looking beyond PCs and servers, establishing metrics and guidance for existing and developing market segments rather than just focusing on how to get to the next process nodes. The IEEE's International Roadmap for Devices and Systems marks a fundamental shift in the industry. The uncertainty that has ensued ever since the introduction of 3D transi... » read more

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