tag: TSMC

Blog Review: March 30
By Jesse Allen - 30 Mar, 2016 - Comments: 0

Are we in a new wave of formal? Mentor's Joe Hupcey III highlights several things from DVCon that indicate formal is becoming a cornerstone of mainstream verification flows. Synopsys' Graham Etchells continues his search for more ways to bring greater efficiency to the FinFET layout process, and the downsides to custom routing solutions. Cadence's Paul McLellan takes a look at TSMC's rapi... » read more

Pain Points At 7nm
By Ed Sperling - 24 Mar, 2016 - Comments: 3

Early work has begun on 7nm. Process technology has progressed to the point where IP and tools are being qualified. There is still a long way to go. But as companies begin engaging with foundries on this process node—[getentity id="22586" comment="TSMC"] is talking publicly about it, but [getentity id="22846" e_name="Intel"], [getentity id="22819" comment="GlobalFoundries"] and [getentity ... » read more

The Week In Review: Design/IoT
By Jesse Allen - 18 Mar, 2016 - Comments: 0

Tools Aldec updated its emulation and simulation acceleration software package for high speed prototyping boards, adding a SCE-MI Pipes-based flow for streaming large amounts of data, and a 30% speed increase for all emulation modes. Plus, Aldec's mixed-language FPGA design and simulation platform now includes a complete coverage analysis package for FPGA and ASIC designers with the addition... » read more

Timing Is Everything
By Ed Sperling - 17 Mar, 2016 - Comments: 0

It's easy to look back on companies or products that missed the market because they were too early. Remember the Eo? The brick-like personal digital assistant that AT&T introduced in 1993 had an antenna that hinted at 4G connectivity. Unfortunately, there was no 4G available at the time, so it was just an extra wire. (Check out the video of the tablet version here.) The EO 440 Personal... » read more

Multi-Beam Market Heats Up
By Mark LaPedus - 17 Mar, 2016 - Comments: 3

The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market. In one surprising move, [getentity id="22846" e_name="Intel"] is in the process of acquiring IMS Nanofabrication, a [gettech id="31058" t_name="multi-beam e-beam"] equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer t... » read more

Where Is Next-Gen Lithography?
By Mark LaPedus - 17 Mar, 2016 - Comments: 4

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

Inside The OSAT Business
By Mark LaPedus - 17 Mar, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

TSMC: Onward to 5nm
By Barry Pangrle - 10 Mar, 2016 - Comments: 0

TSMC’s financial results for the Q4 of 2015 were released in January and showed an 8.5% revenue drop compared to the previous year, and a 3.5% decrease compared to Q3 (all in NT$). For the full year though, TSMC said it had again achieved record sales, with revenue for the full year up over last year by 10.6% in NT$ (5.7% in US$). President and co-CEO Mark Liu reported that TSMC sees a red... » read more

7nm Lithography Choices
By Mark LaPedus - 07 Mar, 2016 - Comments: 2

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm. Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies ... » read more

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