Chip Industry Technical Paper Roundup: June 16


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Eidola: Modeling Multi-GPU Network Communication Traffic in Distributed AI Workloads 🔗 University of Wisconsin-Madison, AMD Beyond Silicon: Materials, Mechanisms, and Methods for Physical Neural Computing 🔗 University of Lübeck, TU Hamburg InjectV: M... » read more

Physical Neural Networks: A Survey (U. of Lübeck, TU Hamburg)


Researchers from the University of Lübeck and TU Hamburg published a technical paper titled “Beyond Silicon: Materials, Mechanisms, and Methods for Physical Neural Computing.” Abstract: “Physical implementations of neural computation now extend far beyond silicon hardware, encompassing substrates such as memristive devices, photonic circuits, mechanical metamaterials, microfluidic netwo... » read more