The Threat Of Supply Chain Insecurity

By Ann Mutschler - 07 Sep, 2023 - Comments: 3

Concerns about counterfeit chips are growing as more chips are deployed in safety- and mission-critical applications, prompting better traceability and new and inexpensive solutions that can determine if chips are new or used. But some counterfeit chips still slip through, and the problem gets worse wherever there are shortages. Estimates vary widely for how much counterfeiting costs in term... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 14 Oct, 2022 - Comments: 0

The United States imposed further export controls aimed at preventing foreign firms from selling advanced chips to China or supplying Chinese firms with semiconductor processing tools. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. Officials noted that they h... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Behind The Intel-GlobalFoundries Rumor

By Ed Sperling - 19 Jul, 2021 - Comments: 5

A Wall Street Journal report that Intel is looking to buy GlobalFoundries has sparked discussions across the industry. But what exactly this would mean, and why now versus a couple years ago, needs some context. There are layers upon layers of irony behind this would-be deal, and it dates back decades to some rather famous encounters. Consider former AMD CEO Jerry Sanders' 1991 comment that ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.