Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Dec, 2018 - Comments: 0

Internet of Things DHL Supply Chain reports that it will spend $300 million to install Internet of Things sensors and collaborative robots in its North American warehouses, bringing 60% of those facilities up to automation capabilities already implemented in 85 of DHL’s 430 warehouses in North America. The company will also employ robotic process automation software and other programs to red... » read more

ADAS Vehicles Will Hit Roads Soon. Should They?

By Ann Mutschler - 07 Sep, 2017 - Comments: 0

Adding fuel to the flurry of activity surrounding autonomous vehicles, yesterday afternoon, the U.S. House of Representatives voted unanimously to approve Bill 3388: ‘To amend title 49, United States Code, regarding the authority of the National Highway Traffic Safety Administration over highly automated vehicles, to provide safety measures for such vehicles, and for other purposes.’ The... » read more

Manufacturing Bits: Nov. 25

By Mark LaPedus - 25 Nov, 2015 - Comments: 0

Asteroid mining and metrology The U.S. House of Representatives has approved a new space bill. The bill, entitled H.R. 2262— U.S. Commercial Space Launch Competitiveness, includes a provision that discusses the rights for companies that mine any materials on asteroids. In simple terms, the bill recognizes the right of U.S. companies to own asteroid resources that they mine in space, accordin... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 19 Sep, 2014 - Comments: 0

Gartner predicts that by 2016 smartwatches will comprise about 40% of consumer wristworn devices. Gartner said that nine out of the top 10 smartphone vendors have entered the wearables market to date or are about to ship a first product, while a year ago only two vendors were in that space. The eBeam Initiative announced the completion of its third annual survey. In one of the highlights of ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.