Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

Saving Power In A UFS Implementation Leveraging MIPI M-PHY And UniPro


The JEDEC Universal Flash Storage (UFS) has become the mobile storage standard of choice for today’s high-end smartphones and tablets mainly due to the specification’s performance and power advantages over other existing solutions. These advantages become critical to meet end users’ requirements for higher responsiveness and increased capabilities. For example, end users expect to transmi... » read more

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