Design And Security Challenges for VR

By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

MIPI Drives Performance For Next-Generation Displays

By Rambus - 07 Jul, 2021 - Comments: 0

MIPI Alliance technology has helped enable the dramatic growth of the mobile phone market. The function and capabilities of MIPI interface solutions have grown dramatically as well. MIPI DSI-2 has become the leading display interface across a growing range of products including smartphones, AR/VR, IoT appliances, and ADAS/autonomous vehicles. As the application space has expanded, so too have t... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 May, 2019 - Comments: 0

ANSYS acquired the assets of DfR Solutions, a developer of automated design reliability analysis software. Founded in 2004 and based in Maryland, DfR's tool translates ECAD and MCAE data into 3D finite element models, automates thermal derating and performs thermal and mechanical analysis of electronics earlier in the design cycle. "ANSYS brings industry-leading electronic simulation capabiliti... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Design And Security Challenges for VR

MIPI Drives Performance For Next-Generation Displays

Week In Review: Design, Low Power

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