Chip Industry Week in Review


Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Formal Verification Of Secure Automotive SW Updates (Chalmers, Volvo)


A technical paper titled "Towards a Formal Verification of Secure Vehicle Software Updates" was published by researchers at Chalmers University of Technology and Volvo. Abstract "With the rise of software-defined vehicles (SDVs), where software governs most vehicle functions alongside enhanced connectivity, the need for secure software updates has become increasingly critical. Software vuln... » read more

Chip Industry Week In Review


China's Hefei Lumiverse Technology reportedly has developed a desktop-sized High Harmonic Generation light source that generates wavelengths as small as 1nm. One customer already has used it to produce 14nm chips, which was the original target node for EUV, according to one report. As a point of comparison, TSMC and Samsung didn't start using EUV until the 7nm node, relying instead on immersion... » read more

Chip Industry Week In Review


Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Chip Industry Week In Review


By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Chip Industry Week In Review


By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

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