Rapid Prototyping For Emerging Semiconductor Devices
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Generating Predictive Models for Emerging Semiconductor Devices” was published by researchers at TU Darmstadt and NaMLab. Abstract: "Circuit design requires fast and scalable models which are compatible to modern electronic design automation tools. For this task typically analytical compact models are preferred. However, for emerging device concepts with altered ... » read more

Quantum Confinement And Its Effect On The Thermoelectric Performance For Thermal Management
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Enhanced thermoelectric performance via quantum confinement in a metal oxide semiconductor field effect transistor for thermal management” was published by researchers at Sandia National Laboratories and Kansas State University. Abstract: "The performance of thermoelectric devices is gauged by the dimensionless figure of merit ZT. Improving ZT has proven to be a ... » read more

Superconducting Material With Exceptional Tunability
By Technical Paper Link - 03 Jan, 2024 - Comments: 0

A technical paper titled “Strain-switchable field-induced superconductivity” was published by researchers at Massachusetts Institute of Technology (MIT), University of Washington, Argonne National Laboratory, Cornell University, Zhejiang University of Science and Technology, and George Mason University. Abstract: "Field-induced superconductivity is a rare phenomenon where an applied magne... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Blog Review: Jan. 3
By Jesse Allen - 03 Jan, 2024 - Comments: 0

Siemens' Stephen Ferguson looks at the history of computer aided engineering through the lens of how humans interact with computers, with each development enabling a step change in engineering productivity, and the new era on the horizon. Cadence's Krunal Patel finds that the security of data transmission can be improved by integrating Ethernet with Internet Protocol Security (IPSec), which ... » read more

Your Path To Robust And Reliable In-Vehicle Networking
By Infineon - 03 Jan, 2024 - Comments: 0

Automotive networking technology is evolving fast, driven by a number of key trends. With a continuously increasing quantity of cars on the road and rising fuel costs, demand for energy efficiency is steadily growing. Worldwide legislation is establishing ever-stricter caps on CO2 emissions. The spotlight is also on functional safety. With the ISO 26262 automotive standard increasingly moving i... » read more

Package Propagation Delay Dependency Of Advanced Fly-By Routing For Next Generation DDR5
By Rambus - 03 Jan, 2024 - Comments: 0

Package signal transit delay is an important parameter for high-speed designs like DDR5. Package delay along with PCB delay dictates the data rates of DDR5 interface running at 4.0 Gbps and beyond. From DDR3 (third generation DDR) onwards, daisy chain routing has been widely used as it can support high data rate operations by providing smaller trace stubs and capacitive loadings. Even so, beyon... » read more

Outlook 2024: An Ever Growing Imperative
By Winbond - 03 Jan, 2024 - Comments: 0

Sustainability is an ever-present and growing imperative. As an industry, we are at the forefront of the drive to innovate towards this goal. We must also accept the challenge of creating these high-performance, high added-value products using sustainable processes and practices. There is constant pressure to use energy and materials as efficiently as possible without compromising the quality a... » read more

Machine Learning Based MBIST Area Estimation
By Cadence - 03 Jan, 2024 - Comments: 0

Majority of the silicon with-in a design is occupied by memories. Memories are more prone to failures than logic due to their density. Several techniques have been established to target and detect defects within these memory instances and their interfacing logic. The most widely used approach is memory built-in self-test (MBIST) that inserts on-chip hardware unit(s) which provides systematic me... » read more

Challenges Facing The Automotive Industry Now And In The Future
By Synopsys - 03 Jan, 2024 - Comments: 0

The next decade may be the most exciting for the automotive industry, with carmakers, suppliers, and consumers all witnessing changes and advancements coming at breakneck speed. In fact, there will likely be more development of new technologies to power vehicles, make them safer and offer more conveniences and services in the next 10 years than in the previous 50 years. Battery-electric powertr... » read more

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