Enhancing Punch MLF Packaging with Edge Protection Technology

By Amkor - 14 Jun, 2023 - Comments: 0

Quad Flat No-Lead (QFN) semiconductor packaging provides a small form factor as well as good electrical and thermal performance for low cost. Add demonstrated long term reliability to its benefits and it is easy to see why it has been a preferred automotive package for many years. QFNs are offered in saw and punch formats with punch being a well-defined and used solution in the automotive marke... » read more

Blog Review: June 14

By Jesse Allen - 14 Jun, 2023 - Comments: 0

Synopsys' Richard Solomon and Gary Ruggles examine the Compute Express Link (CXL) protocol and how it could unlock new ways of doing computing such as enabling efficient heterogeneous computing architectures, accelerating data-intensive workloads, and facilitating advanced real-time analytics. Cadence's Andre Baguenie explains how to convert an electrical signal to a logic value using the Ve... » read more

Mitigating Voltage Droop

By Aakash Jani - 13 Jun, 2023 - Comments: 0

Voltage droop, also known as IR drop, is a phenomenon that occurs when the current in the power delivery network abruptly changes due to workload fluctuations. This can lead to supply voltage drops across system-on-chips (SoCs) which can cause severe performance degradation, limit their energy efficiency, and in extreme cases can cause catastrophic timing failures. To avoid these issues, conven... » read more

Chip Industry’s Technical Paper Roundup: June 13

By Liz Allan - 13 Jun, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

Research Bits: June 13

By Jesse Allen - 13 Jun, 2023 - Comments: 0

Converting heat to electricity Researchers at the National Institute of Standards and Technology (NIST) and University of Colorado Boulder fabricated a device to boost the conversion of heat into electricity. The technique involves depositing hundreds of thousands of microscopic columns of gallium nitride atop a silicon wafer. Layers of silicon are then removed from the underside of the waf... » read more

Striking A Balance In Acoustic Inspection

By Ed Sperling - 12 Jun, 2023 - Comments: 0

Sound energy is a quick way to to spot voids, delamination, cracks, and other possible defects that are accessible from outside the chip or package, as well as some defects that are inside of chips. But acoustic inspection also is highly sensitive to different materials with different polarities, which can change the reflection of sound waves. Bill Zuckerman, product marketing manager at Nordso... » read more

Auto Industry Relationships Re-Form, But Differently

By Ann Mutschler - 12 Jun, 2023 - Comments: 0

The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. But all of this is dependent on the relationships between all of the ecosyst... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 09 Jun, 2023 - Comments: 0

The European Union’s Chips Act Commission has approved €8.1 billion ($8.73 billion) in funding for an Important Project of Common European Interest (IPCEI). As part of this IPCEI, 56 companies, including small and medium-sized enterprises (‘SMEs') and start-ups, will undertake 68 projects in research, innovation, and deployment of microelectronics and communication technologies across th... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 09 Jun, 2023 - Comments: 0

Apple uncorked its spatial computer, the Vision Pro, and a new operating system, the visionOS. The “infinite screen real estate” basically untethers the screen from the box, allowing users to work in multiple windows with no space limits. While the device garnered mixed reviews, largely based upon its $3,500 price tag, the implications of mixed-reality computing are potentially significant ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 09 Jun, 2023 - Comments: 0

Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

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