Advanced Outlier Die Control Technology In Fan-Out Panel Level Packaging Using Feedforward Lithography
By Onto Innovation - 12 Oct, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Fan-out panel level packaging (FOPLP) is one of the technologies that... » read more

High-Speed Image Processing By GPU
By Advantest - 12 Oct, 2021 - Comments: 0

By using CPU and GPU together, we have increased the speed of the filter function that is often used in imaging tests. This feature is provided by the Image Processing Library (IPL) in T2000 CMOS Image Sensor Solution. Next IPE, our new image processing engine that is currently in development, is about six times faster than IPE3 (Image Processing Engine 3), an existing engine. Author: Chiezo... » read more

Accelerating Verification Shift Left With Intelligent Coverage Optimization
By Synopsys - 12 Oct, 2021 - Comments: 0

Functional verification dominates semiconductor development, consuming the largest percentage of project time and resources. Team members look at the rate of design bug discovery, consider anecdotal information on the types of bugs that escaped to silicon in previous projects, and use their best judgment based on their years of experience to determine when to tape out. Above all, they look at v... » read more

Dual Surface Architectonics for Directed Self‐Assembly of Ultrahigh‐Resolution Electronics
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract: "The directed self‐assembly of electronic circuits using functional metallic inks has attracted intensive attention because of its high compatibility with extensive applications ranging from soft printed circuits to wearable devices. However, the typical resolution of conventional self‐assembly technologies is not sufficient for practical applications in the rapidly evolving addi... » read more

Multicolored Nanocolloidal Hydrogel Inks For Anti-Counterfeiting
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract "Nanocolloidal gels are emerging as a promising class of materials with applications as inks in 2D and 3D printing. Polymer nanoparticles (NPs) offer many advantages as potential building blocks of nanocolloidal gels, due to the ability to control NP dimensions, charge, surface chemistry, and functionality; however, their applications as inks in printing are yet to be explored. Here, ... » read more

Probe assisted localized doping of aluminum into silicon substrates
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract "This paper discusses the development of a rapid, large-scale integration of deterministic dopant placement technique for encoding information in physical structures at the nanoscale. The doped structures inherit identical and customizable radiofrequency (RF) electronic signature, which could be leveraged into an identification feature unique to the tag item. This will allow any manuf... » read more

Growing Challenges With Wafer Bump Inspection
By Ed Sperling - 11 Oct, 2021 - Comments: 1

As advanced packaging goes mainstream, ensuring that wafer bumps are consistent has emerged as a critical concern for foundries and OSATs. John Hoffman, computer vision engineering manager at CyberOptics, talks about the shift toward middle-of-line and how that is affecting inspection and metrology, why there is so much concern over co-planarity and alignment, how variation can add up and creat... » read more

Manufacturing Bits: Oct. 11
By Mark LaPedus - 11 Oct, 2021 - Comments: 0

IC security using AFMs The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market. PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tin... » read more

AV-Over-IP: Decisions, Decisions…
By Rob Green - 11 Oct, 2021 - Comments: 0

By Rob Green and Andrew Starks You know it’s coming, and you need to be ready for it, but the path to supporting AV-over-IP in your next generation product is still really confusing and choosing a particular protocol implementation feels like a gamble that you just can’t afford to lose! It’s clear that the benefits of moving to IP-based transport for audio, video, and associated dat... » read more

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

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