Servers And The Drive To DDR5
By Rambus - 13 Aug, 2021 - Comments: 0

This IDC Technology Spotlight Study, sponsored by Rambus, discusses server demands on DRAM and different workloads. DRAM must dynamically adjust to the needs of these disparate workloads. The history of dynamic random-access memory (DRAM) is characterized by the ability of the technology to adapt to the increasingly specialized real-time memory requirements of the applications that utilize it. ... » read more

Condition Monitoring Of Drive Trains By Data Fusion Of Acoustic Emission And Vibration Sensors
By Fraunhofer IIS/EAS - 13 Aug, 2021 - Comments: 0

Early damage detection and classification by condition monitoring systems is crucial to enable predictive maintenance of manufacturing systems and industrial facilities. The data analysis can be improved by applying machine learning algorithms and fusion of data from heterogenous sensors. This paper presents an approach for a step-wise integration of classifications gained from vibration and ac... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Aug, 2021 - Comments: 0

Mobix Labs finalized its acquisition of Cosemi Technologies, a provider of hybrid active optical cables, optical transceivers, and optical engines. Mobix Labs provides wireless connectivity solutions with CMOS-based mmWave beamformers, antenna solutions, and RF semiconductors. “Our Cosemi acquisition bridges the gap between wireless and wired applications, enabling Mobix Labs to bring a full ... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations
By Ansys - 13 Aug, 2021 - Comments: 0

Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 13 Aug, 2021 - Comments: 0

Automotive Infineon announced a new MEMS scanner chipset for automotive heads-up displays (HUD) and AR (augmented reality) eyeglasses. The design has MEMS mirror — which tilts and can work with laser beam scanner (LBS) projectors — and MEMS driver. The size and energy use is small and yet it projects content over a wider area of the windshield. A partnership between Ansys and IPG Automo... » read more

The “Natively Flexible” Processor Has Arrived: Here’s What We Need To Make It Mainstream
By John Biggs - 12 Aug, 2021 - Comments: 0

The microprocessor is one of history’s pivotal inventions, ranking in influence with breakthroughs such as the wheel, the transistor, and the printing press. There is no escaping their popularity or usefulness either: with tens of billions of processors produced each year they have revolutionized industries such as health care, media, retail, transportation, and of course information manageme... » read more

Now You Can Automate Latch-Up Verification For 2.5/3D Technologies
By Dina Medhat - 12 Aug, 2021 - Comments: 0

Latch-up is modeled as a short circuit (low-impedance path) that can occur in an integrated circuit (IC). It may lead to destruction due to over-current resulting from interactions between parasitic devices (PNP and NPN). To protect against latch-up conditions, there are two key types of latch-up design rules—fundamental and advanced [1,2]. Fundamental rules are the local latch-up design r... » read more

Time To Rethink Memory Chip Design And Verification
By Anand Thiruvengadam - 12 Aug, 2021 - Comments: 1

It’s no secret to anyone that semiconductor development grows more challenging all the time. Each new process technology node packs more transistors into each die, creating more electrical issues and making heat dissipation harder. Floorplanning, logic synthesis, place and route, timing analysis, electrical analysis, and functional verification stretch electronic design automation (EDA) tools... » read more

Lowering Energy Per Bit
By Ann Mutschler - 12 Aug, 2021 - Comments: 0

Energy is emerging as a focal point in chip and system design, but solving energy-related issues needs to be dealt with on a much broader scale than design teams typically see. Energy is the amount of power consumed over a period of time to perform a given task, but reducing energy is a lot different than reducing power. It affects everything from operational costs and system performance to ... » read more

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