Week In Review: Auto, Security, Pervasive Computing

IoT leaders; Mixel ISO 26262 FuSa; Infineon heads up display.


Infineon announced a new MEMS scanner chipset for automotive heads-up displays (HUD) and AR (augmented reality) eyeglasses. The design has MEMS mirror — which tilts and can work with laser beam scanner (LBS) projectors — and MEMS driver. The size and energy use is small and yet it projects content over a wider area of the windshield.

A partnership between Ansys and IPG Automotive promises to help automotive manufacturers avoid billions of miles of real-life road testing of autonomous vehicles (AVs) and advanced driver-assistance systems (ADASes). The companies are providing customers combined access to their tools — Ansys VRXPERIENCE with IPG Automotive’s CarMaker. Joint customers will be able to virtually verify and validate sensor design and performance to simulate sensor self-driving vehicles.

SGS-TUV Saar has certified that Mixel’s development processes and products meet ISO 26262:2018 for automotive functional safety. Prior to its ISO 26262 certification, the company had ISO 26262:2015 certification. Recently Mixel achieved an ISO 9001 Quality Management System Certification from DEKRA Certification for IP quality management system, directly before earning its ISO 26262:2018 certification. ISO 26262 requires that a company operates in and values safety culture up and down the supply chain. Both ISO certifications cover Mixel’s headquarters in San Jose, California, and its satellite operations in Cairo, Egypt. Mixel designs mixed-signal, silicon-proven IP cores. Specifically its MIPI PHYs IP went through the ISO 26262:2018 audit.

Pervasive computing — IoT, edge, cloud, data center, and back
The top IoT market leaders are Microsoft, Siemens, PTC, and SAP, according to IDC Marketplace in a study. The report — the IDC MarketScape: Worldwide Industrial IoT Platforms and Applications in Manufacturing 2021 Vendor Assessment (July 2021) — looked at vendor capabilities in companies that had global customers that they were able to support, made at least $15 million from IoT, had at least 20% of its revenue coming from manufacturing vertical, offers a platform, integration, an ecosystem, and analytics, among other criteria. Interesting companies that could not meet the all the study criteria were mentioned, but the indepth comments were reserved for companies that made the criteria. Siemens was mentioned for its Mindsphere platform, its digital twin strategy, and customer support.

Researchers from NIST (the United States’ National Institute of Standards and Technology) say they have developed a modeling technique that cuts the number of measurements for spectrum sharing by 33%.

AI processor company Mythic will use Codasip’s L30 RISC‑V‑based core for Mythic’s next generation Analog Matrix Processor (Mythic AMP), an edge AI chip that uses analog compute-in-memory technology. Mythic launched the first generation, the M1108 AMP, in November 2020, and its M1076 Mythic AMP in June 2021. Codasip’s RISC-V core will be in the M1076.

People, companies
The trade organization SEMI released its Diversity, Equity and Inclusion Roadmap and Toolkit to help the semiconductor industry build a more diverse workforce. The roadmap has practical strategies to help establish non-biased hiring practices and equitable policies. “The Diversity, Equity and Roadmap and Toolkit will help expand the pool of workers for SEMI members,” said Shari Liss, executive director of the SEMI Foundation, in a press release. “Equal opportunity is the bedrock of all SEMI Foundation programs. We continue to nurture talent and build awareness of the microelectronics industry as a career destination at all levels — from grade school and post-secondary education to veterans and people returning to the workforce.”

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