High Thermal Die-Attach Paste Development For Analog Circuits

By Amkor - 16 Jun, 2021 - Comments: 0

In recent years, various die attach (DA) materials have been developed to cope with the higher power dissipation requirements of semiconductor devices. DA materials based on metals such as solder or sintered silver (Ag) are used for very high heat generating power devices. While they show outstanding thermal performance, the mechanical properties of these materials are less than ideal. This lim... » read more

Process Model Calibration: The Key To Building Predictive And Accurate 3D Process Models

By Coventor - 16 Jun, 2021 - Comments: 0

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are len... » read more

High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications

By Brewer Science - 16 Jun, 2021 - Comments: 0

Brewer Science, Inc. has developed a class of novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability. These SOCs are cured under mild conditions and have flow properties that enable the fill of high-aspect-ratio vias in a void-free manner. Moreover, this new class of SOCs has remarkable thermal stability and can survive temperatures of up to 550°C wit... » read more

Blog Review: June 16

By Jesse Allen - 16 Jun, 2021 - Comments: 0

Arm's Adrian Herrera explores the latest version of AMBA ATP Engine, an open-source implementation of the AMBA Adaptive Traffic Profiles (ATP) synthetic traffic framework specification, which adds the ability to program AMBA ATP traffic generation from Linux environments. Cadence's Paul McLellan finds out just how effective glitching chips is by delivering incorrect voltages and clock freque... » read more

Staying A Step Ahead Of Hackers With Continuous Verification

By John Hallman - 16 Jun, 2021 - Comments: 0

We’re all familiar with the apps on our phones and how often they get updated. Most of the time, these updates are done over the air quickly and easily. Other times, a completely new download of the software is required. But let’s take a look at the hardware platforms that the software runs on. What happens when the hardware needs to be upgraded? Today’s hardware platforms are expensive t... » read more

Replacement Gate High-k/Metal Gate nMOSFETs Using A Self-Aligned Halo-Compensated Channel Implant

By UMC - 16 Jun, 2021 - Comments: 0

A device design technique for boosting output resistance (Rout) characteristics of long-channel halo-doped nMOSFETs for replacement gate (RMG) high-k/metal gate (HK/MG) devices is proposed based on numerical simulations. We show that the self-aligned halo-compensated channel implant (HCCI) that is carried out after dummy poly gate removal provides compensation for the conventional halo doping. ... » read more

Manufacturing Bits: June 15

By Mark LaPedus - 15 Jun, 2021 - Comments: 0

Next-gen RF signal processors Sandia National Laboratories has taken steps to realize the development of acoustic wave amplifiers, a technology that could one day pave the way towards long-awaited tiny RF signal processors. Researchers have developed piezoelectric acoustic devices using surface acoustic wave (SAW) technology and demonstrated the ability to manufacture these devices. Still i... » read more

Power/Performance Bits: June 15

By Jesse Allen - 15 Jun, 2021 - Comments: 0

Low-loss photonic IC Researchers at EPFL built a photonic integrated circuit with ultra-low loss. The team focused on silicon nitride (Si3N4), which has orders of magnitude lower optical loss compared to silicon. It is used in low-loss applications such as narrow-linewidth lasers, photonic delay lines, and nonlinear photonics. In applying the material to photonic ICs, they took advantage... » read more

NN-Baton: DNN Workload Orchestration & Chiplet Granularity Exploration for Multichip Accelerators

By Technical Paper Link - 14 Jun, 2021 - Comments: 0

"Abstract—The revolution of machine learning poses an unprecedented demand for computation resources, urging more transistors on a single monolithic chip, which is not sustainable in the Post-Moore era. The multichip integration with small functional dies, called chiplets, can reduce the manufacturing cost, improve the fabrication yield, and achieve die-level reuse for different system scales... » read more

TimeCache: Using Time to Eliminate Cache Side Channels when Sharing Software

By Technical Paper Link - 14 Jun, 2021 - Comments: 0

"Abstract—Timing side channels have been used to extract cryptographic keys and sensitive documents even from trusted enclaves. Specifically, cache side channels created by reuse of shared code or data in the memory hierarchy have been exploited by several known attacks, e.g., evict+reload for recovering an RSA key and Spectre variants for leaking speculatively loaded data. In this paper, we ... » read more

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