How 5G Is Influencing Silicon Design
By Synopsys - 21 Dec, 2020 - Comments: 0

5G is introducing a wide array of challenges in next-generation SoCs that go well beyond high bandwidth wireless. These include increasing system bandwidth, lowering SoC latency, and reducing power significantly for the connected internet of things. Using trusted standards-based IP and proven processing and analog IP at the most aggressive process technology nodes is needed to bring 5G to marke... » read more

Chiplets And Heterogeneous Packaging Are Changing System Design And Analysis
By Cadence - 21 Dec, 2020 - Comments: 0

In the domain of electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes has everyone looking for alternatives to the traditional monolithic system on chip (SoC). The path most are taking leads to the world of “More than Moore�... » read more

A Collaborative Data Model For AI/ML In EDA
By Si2 - 21 Dec, 2020 - Comments: 0

This work explores industry perspectives on: Machine Learning and IC Design Demand for Data Structure of a Data Model A Unified Data Model: Digital and Analog examples Definition and Characteristics of Derived Data for ML Applications Need for IP Protection Unique Requirements for Inferencing Models Key Analysis Domains Conclusions and Proposed Future Work Abstra... » read more

Mythic Case Study
By Codasip - 21 Dec, 2020 - Comments: 0

Mythic, the provider of a unique AI compute platform, was designing an innovative intelligence processing unit (IPU) and found themselves in need of a small, power-efficient, yet programmable core to take care of specific supporting functions. As no off-the-shelf core would exactly match the needs and customization proved challenging, Mythic eventually opted for a complete solution by Codasip. ... » read more

Process Window Optimization Of DRAM By Virtual Fabrication
By Daebin Yim - 21 Dec, 2020 - Comments: 0

New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes in 2D structures to the more challenging full integration of complex 3D structures. Conventional 2D layout DRC, offline wafer metrology, and offline electrical measurements are no longer sufficient... » read more

Variation Threat In Advanced Nodes, Packages Grows
By Ed Sperling - 21 Dec, 2020 - Comments: 0

Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Dec, 2020 - Comments: 0

Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Dec, 2020 - Comments: 0

Tools, Cloud, IP Valtrix Systems updated its STING design verification tool for RISC-V based CPU and SoC implementations. Version 1.9.0 adds support to verify recent changes to the RISC-V user and privilege specifications, including draft versions of the vector and bit manipulation standard extensions. Preliminary support for the draft version of the RISC-V hypervisor extension has also been a... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 18 Dec, 2020 - Comments: 0

Automotive Austin, Texas-based automotive startup Uhnder raised $45 million in Series C funding for its digital radar-on-chip. Telechips, a fabless semiconductor company that works on automotive SoCs, is using Arm’s IP to design its Dolphin5 SoC for ADAS (advanced drive assistance systems) and digital cockpits with in-vehicle infotainment (IVI). Dolphin5 will include the Arm’s Mali-G78A... » read more

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

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