GDDR7 Momentum Accelerates As A Key Solution For AI Inference


The AI hardware landscape continues to evolve at a breakneck speed, and memory technology is rapidly becoming a defining differentiator for the next generation of GPUs and AI inference accelerators. When NVIDIA introduced Rubin CPX, its new class of GPU tailored for massive context inference, it underscored a new industry reality: memory throughput and efficiency are now just as critical as ra... » read more

Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY


By Michael Nagib and Nuno Martins In the ever-evolving landscape of high-performance camera and display technologies, MIPI D-PHY and MIPI C-PHY specifications continue to lead the charge, setting benchmarks for low power, low latency, and high bandwidth data transmission. Building on the insights from our previous article, “Demystifying MIPI C-PHY/D–PHY Subsystem” – we now delve into... » read more

Smarter Write Barriers For Arm64 In .NET CoreCLR


Last year, I explored how you can use the Arm Scalable Vector Extension (SVE) in .NET to unlock SIMD performance at scale. This year, my focus has shifted to something less visible but just as fundamental to runtime performance. Write barriers in the CoreCLR garbage collector (GC). Write barriers are not a feature most .NET developers ever think about. They do not change how you write C# cod... » read more

Whale-Inspired Propulsion System To Reduce Operating Costs By 20%


This article is an excerpt from the presentation delivered by Bluefins at CadenceCONNECT CFD 2025. Shipping is essential to global trade, as it transports nearly 90% of all traded goods. Large ships consume between 20 to 70 tons of fuel daily, which translates to approximately 15 million euros in annual fuel costs. This level of fuel consumption results in emissions of up to 75,000 tons of C... » read more

AI In A/MS IC Design: Between Buzzword And Productivity Boost


In the past few years, AI has burst onto the public stage in grand style. This ongoing trend is apparent in the rising number of AI applications in everyday life. But more and more, it can also be seen in a broad range of technical niches, where the main motivation is AI’s promise of continuously increasing efficiency. One such niche that has seen decades of attempts to achieve greater eff... » read more

PCIe 8.0: Preparing For The Next Doubling


By Monica Olvera and Gustavo Pimentel Every few years, the industry confronts the same challenge: can general-purpose I/O double again without overwhelming power budgets, overwhelming signal-integrity limits, or fragmenting the ecosystem? With PCIe 8.0, the answer appears to be yes—if the entire stack continues to advance together. Public PCI-SIG information outlines an objective of 256.0 ... » read more

AI Moves Out Of The Cloud And Onto The Edge


The impact of AI to date, in the cloud, is undisputed, but the question we must answer going forward is whether we can only expect more of the same or whether there is a fundamental shift looming that will change everything. Today, we will explore historical data to find patterns repeated through the ages to help us see what I will attempt to prove is imminent. A brief history of time… keepi... » read more

MIPI CSI-2 Provides The Backbone Of Automotive Sensor Networks


As the automotive sector accelerates toward higher levels of autonomy, the complexity and scale of sensor networks within vehicles are rapidly expanding. For semiconductor engineers, the challenge is not only to deliver high-performance silicon but also to ensure robust, scalable, and secure data transport across heterogeneous sensor arrays. The MIPI CSI-2 protocol has emerged as the de facto s... » read more

Next Generation AI: Transitioning Inference From The Cloud To The Edge


AI inference deployments are increasingly focused on the edge as manufacturers seek the consistent latency, enhanced privacy, and reduced operational costs they can’t achieve in cloud-based deployments. While cloud-based platforms provide incredible computational power and enable widely adopted services, the dependence on network connectivity inherently creates variability, cost and security ... » read more

Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies


As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a downstream constraint to a fundamental design driver. The dense vertical integration that enables unprecedented performance also concentrates heat at levels that traditional two-dimensional design ... » read more

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