category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Backside Power Delivery as a Scaling Knob for Future Systems
By Coventor - 14 Aug, 2019 - Comments: 0

Standard cell track height scaling provides us with sufficient area scaling at the standard cell library level. The efficiency of this technique and the complexities involved with this scaling method have been discussed in detail. However, the area benefits of standard cell track height scaling diminish when we consider the complexities of incorporating on-chip power grid into the DTCO explorat... » read more

Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
By Brewer Science - 14 Aug, 2019 - Comments: 0

Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to achieve lower profile packages without using an inorganic substrate to produce chip packages that are thinner and faster without the need for interposers or through-silicon-vias (TSVs). One approa... » read more

High Voltage Applications.
By UMC - 14 Aug, 2019 - Comments: 0

Today’s high-resolution displays and high data transmission speed have been driving the rapidly growing embedded high voltage (eHV) IC market. UMC supports these applications with extensive and proven eHV technologies, while continuing to invest in research and development to provide more and better solutions to meet current and future requirements for the ever-expanding eHV market. Click... » read more

Reliability Comparison of 28 V – 50 V GaN-on-SiC S-Band and X-Band Technologies
By Wolfspeed, a Cree Company - 14 Aug, 2019 - Comments: 0

This paper discusses the reliability performance of Wolfspeed GaN/AlGaN high electron mobility transistor (HEMT) MMIC released process technologies, fabricated on 100 mm high purity semi-insulating (HPSI) 4H-SiC substrates. The intrinsic reliability performance of the 28 V and 40 V technologies, with 400 nm and 250 nm gate length, has been characterized with DC accelerated life test (DC-ALT), f... » read more

Manufacturing Bits: Aug. 13
By Mark LaPedus - 13 Aug, 2019 - Comments: 0

Exascale supercomputers The Department of Energy’s National Nuclear Security Administration (DOE/NNSA) has signed a contract valued at $600 million with Cray to build NNSA’s first exascale supercomputer. The system, called El Capitan, is expected to be shipped in late 2022. El Capitan will be housed at Lawrence Livermore National Laboratory (LLNL), and will perform research to maintain ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Process Window Optimization
By Ed Sperling - 07 Aug, 2019 - Comments: 0

David Fried, vice president of computational products at Lam Research, examines increasing process variation and interactions between various types of variation, why different approaches are necessary to improve yield and continue scaling. » read more

Manufacturing Bits: Aug. 5
By Mark LaPedus - 05 Aug, 2019 - Comments: 0

Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Aug, 2019 - Comments: 0

Trade wars Talks between the United States and China continue to stall and the two nations are still embroiled in a trade war. So this week, U.S. President Donald Trump would like to impose a 10% tariff on the remaining $300 billion list of China-based imports starting Sept. 1, according to a report from Reuters. This in turn will impact the electronics and IC industries. In response to the... » read more

Manufacturing Bits: July 30
By Mark LaPedus - 30 Jul, 2019 - Comments: 0

Scanning nanopore microscopes ETH Zurich has developed a new microscopy technique that can detect and analyze signals between individual cells in living organisms. The technology, called a force-controlled scanning nanopore microscope, is a new way to look at the behavior of individual cells. So far, researchers have tested the technology on rat brain tissue. It could one day be used to pro... » read more

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