category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Aug, 2018 - Comments: 0

Trade wars After opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, recently spoke out against an additional $16 billion in duties on Chinese goods. The tariffs do little to address U.S. concerns over IP loss, according to SEMI. Over the past month, SEMI has also submitte... » read more

Manufacturing Bits: July 31
By Mark LaPedus - 31 Jul, 2018 - Comments: 0

Florida R&D fab A new microelectronics R&D initiative in Florida is expanding its operations and readying its new 200mm fab facility. The initiative, called BRIDG, describes itself as a non-profit, public-private partnership. BRIDG is basically an R&D microelectronics facility, which is focusing on the development of select technologies, such as photonics, sensors, imagers and 2.5D/3D pac... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Manufacturing Bits: July 24
By Mark LaPedus - 24 Jul, 2018 - Comments: 0

Fast rotors Purdue University and others have developed what researchers claim is the world’s fastest man-made rotor. Researchers devised a tiny dumbbell from silica. Then, the object was levitated in a vacuum using a laser, thereby creating a spinning effect. This, in turn, enabled more than 60 billion revolutions per minute or more than 100,000 times faster than a dental drill. The t... » read more

Everything You Need to Know about FDSOI Technology
By Coventor - 23 Jul, 2018 - Comments: 0

Over the past decades, transistor feature size has continuously decreased, leading to an increase in performance and a reduction in power consumption. Consumers have reaped the benefits, with superior electronic devices that have become increasingly useful, valuable, faster and more efficient. In recent years, as transistor feature size has shrunk below 10nm, it has become progressively more di... » read more

Benefits And New Applications For FD-SOI
By Sofiane Guissi - 23 Jul, 2018 - Comments: 0

Over the past decades, transistor feature size has continuously decreased, leading to an increase in performance and a reduction in power consumption. Consumers have reaped the benefits, with superior electronic devices that have become increasingly useful, valuable, faster and more efficient. In recent years, as transistor feature size has shrunk below 10nm, it has become progressively more di... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Jul, 2018 - Comments: 0

Chipmakers TSMC has reduced its outlook for 2018 revenue and capital spending, according to Bloomberg. The company blamed the outlook on sluggish “mobile and digital currency mining demand,” according to the report. Samsung has developed the industry’s first 10nm-class 8-gigabit LPDDR5 DRAM. The 8Gb LPDDR5 boasts a data rate of up to 6,400 megabits-per-second (Mb/s), which is 1.5 tim... » read more

Scaling Sideways
By Ed Sperling - 19 Jul, 2018 - Comments: 0

The next steps in semiconductor technology don't follow the same vectors. While 3nm chips are likely to roll out at some point in the future, it's not clear what the business case will be for developing them. What's clear is the number of companies developing chips at that node will shrink to a handful (or less), because they're going to be far too expensive to design, verify and manufacture... » read more

Leti’s Next Focus
By Mark LaPedus - 19 Jul, 2018 - Comments: 0

Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

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