category: News

category: Auto, Security & Edge AI

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week in Review: IoT
By Jeff Dorsch - 10 Nov, 2017 - Comments: 0

Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

The Week In Review: Design
By Jesse Allen - 10 Nov, 2017 - Comments: 0

IP Cryptographic flaws have been discovered in the IEEE P1735 standard for encrypting IP and managing access rights. A team from the University of Florida found "a surprising number of cryptographic mistakes in the standard. In the most egregious cases, these mistakes enable attack vectors that allow us to recover the entire underlying plaintext IP." The researchers warn that an adversary coul... » read more

Blog Review: Nov. 8
By Jesse Allen - 08 Nov, 2017 - Comments: 0

Synopsys' Eric Huang digs in to what's new with USB 3.2 and what's achieved by preserving the existing PHY signaling speeds. In a video, Mentor's Colin Walls provides tips on how to write debuggable and maintainable embedded code. Cadence's Paul McLellan listens in on a talk by Andrew Kahng of UC San Diego on the problem of scaling and why machine learning can improve EDA tools. Rambus... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

The Week In Review: Design
By Jesse Allen - 03 Nov, 2017 - Comments: 0

M&A Synopsys will acquire Black Duck Software, a provider of software for securing and managing open source software. Synopsys already has a stake in this area from its Coverity acquisition in 2014, which it has been using to analyze security practices in open source software. Founded in 2003 and headquartered in Massachusetts, Black Duck's products automate the process of identifying and ... » read more

The Week in Review: IoT
By Jeff Dorsch - 03 Nov, 2017 - Comments: 0

Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

Blog Review: Nov. 1
By Jesse Allen - 01 Nov, 2017 - Comments: 0

Mentor's Nitin Bhagwath continues digging into DDR timing with a look at the clock-to-DQS requirement at the DRAM and how "write-leveling" is used to solve layout issues caused by the requirement. Synopsys' Dipesh Handa checks out what's new in the MIPI CSI-2 v2.0 specification that opens it up to new imaging and vision applications, including IoT and automotive. Cadence's Ken Willis delv... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

The Week In Review: Design
By Jesse Allen - 27 Oct, 2017 - Comments: 0

M&A PLDA is divesting its Reflex CES brand. The FPGA board maker will become wholly managed by its own management and investment teams. In 2015, Reflex CES took over the hardware businesses of PLDA, including FPGA-based boards and the System-on-Module product lines. Tools Mentor uncorked a new tool for in-system test and diagnosis of automotive ICs. Tessent MissionMode provides infrast... » read more

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