category: News

category: Auto, Security & Edge AI

Blog Review: March 25
By Jesse Allen - 25 Mar, 2015 - Comments: 0

From brain implants that recover memories to color-shifting shoes, Ansys' Bill Vandermark features sci-fi visions of the future that are becoming reality in his top five tech picks of the week. In the world of embedded software, is a black box better? Mentor's Colin Walls questions whether the advantages that come of having full access to source code outweigh the downsides. Cadence's Neel... » read more

Manufacturing Bits: March 24
By Mark LaPedus - 24 Mar, 2015 - Comments: 0

Mouse brains to multi-beam At the recent SPIE Advanced Lithography conference, Sematech provided an update on its multi-beam, e-beam inspection program. The goal is to develop a next-generation inspection tool, which could be faster than traditional e-beam inspection and could one day displace brightfield inspection. “Optical inspection is having trouble detecting particles that are small... » read more

System Bits: March 24
By Ann Mutschler - 24 Mar, 2015 - Comments: 0

A better band-aid UC Berkeley engineers are working on a bandage that can detect bedsores before they are visible - while recovery from them is still possible. Leveraging flexible electronics advancements, the researchers collaborated with colleagues at UC San Francisco to create their “smart bandage” that uses electrical currents to detect early tissue damage from pressure ulcers as th... » read more

Power/Performance Bits: March 24
By Jesse Allen - 24 Mar, 2015 - Comments: 0

Power from packing peanuts After setting up a new lab, a Purdue University research team was left with a problem: mountains of packing peanuts. Instead of filling bags destined for a dumpster, the team saw an opportunity to find the packing material a useful purpose. The result was a process to convert waste packing peanuts into high-performance carbon electrodes for rechargeable lithium-... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Mar, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. Now, Altera will soon select a foundry partner for 10nm. “Altera will make a decision on which foundry partner it will choose for 10nm finFET at the end of 1Q15, noting it will decide between Intel and TSMC,” said John Vin... » read more

The Week In Review: Design/IoT
By Jesse Allen - 20 Mar, 2015 - Comments: 0

Mergers & Acquisitions Silvaco acquired Invarian, anticipating integration of Invarian's methodology will accelerate adoption of concurrent power-voltage-thermal analysis. Legal A U.S. District Court judge ordered Kilopass to pay $5.5 million to Sidense for legal fees incurred in Kilopass' patent infringement suit against Sidense. That lawsuit was  dismissed in 2012. Sidense filed... » read more

Blog Review: March 18
By Jesse Allen - 18 Mar, 2015 - Comments: 0

How do you quantify effort spent in FPGA verification? Mentor's Harry Foster tackles the question in his latest installment of the Wilson Research Group functional verification study. A new frontier of design challenges is rapidly emerging, according to ARM CEO Simon Segars. Cadence's Brian Fuller brings us his keynote address at CDNLive. Synopsys' Tushar Mattu is back with more on AXI VI... » read more

Manufacturing Bits: March 17
By Mark LaPedus - 17 Mar, 2015 - Comments: 0

EUV source firm seeks help In 2012, a startup called Zplasma came out of stealth mode and introduced its first technology—a next-generation power source for extreme ultraviolet (EUV) lithography. But after much fanfare and hope, Zplasma has been unable to commercialize its EUV source technology. The company has also been unable to attract a development partner or outside funding. And t... » read more

System Bits: March 17
By Ann Mutschler - 17 Mar, 2015 - Comments: 0

Symmetry in graphene growth According to Rice University researchers, what lies beneath growing islands of graphene is important to its properties. The team analyzed patterns of graphene – a single-atom-thick sheet of carbon – grown in a furnace via chemical vapor deposition and discovered that the geometric relationship between graphene and the substrate, the underlying material on whi... » read more

Power/Performance Bits: March 17
By Jesse Allen - 17 Mar, 2015 - Comments: 0

Artificial photosynthesis: leaves of nickel Inspired by a chemical process found in leaves, Caltech scientists developed an electrically conductive film that could help pave the way for devices capable of harnessing sunlight to split water into hydrogen fuel. When applied to semiconducting materials (it's been tested with silicon, indium phosphide, and cadmium telluride), the team's film ... » read more

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