category: System-Level Design

category: Auto, Security & Edge AI

NoC Versus PIN: Size Matters
By Drew Wingard - 09 Oct, 2015 - Comments: 1

Since I first helped introduce the concept of applying networking techniques to address SoC integration challenges in 2007, I have been asked many hundreds of times how to determine when and where to best use an on-chip network (NoC) instead of a passive interconnect network (PIN)? Is there a minimum number of initiators and targets below which it makes more sense to use a PIN for the SoC archi... » read more

The Week In Review: Design/IoT
By Jesse Allen - 09 Oct, 2015 - Comments: 0

Imec and Cadence completed the first tapeout of a 5nm test chip. Using a processor design, the companies taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. Tools Synopsys folded in recent acquisition Atrenta's testabilit... » read more

Blog Review: Oct. 7
By Jesse Allen - 07 Oct, 2015 - Comments: 0

Ansys' Sunil Nakum takes a look at backing up the brain and concludes that we would need to keep following Moore's Law for a long time given the current approaches and leave several questions unanswered. There is a battle brewing between high-efficiency LED lighting and vintage-style Edison bulbs. With the latest lighting fad, Mentor's John McMillan asks, is style and nostalgia beating high-... » read more

System Bits: Oct. 6
By Ann Mutschler - 06 Oct, 2015 - Comments: 0

Tiny graphene pores for sensors In fundamental work that will likely guide current and future graphene membrane design principles in years to come, MIT researchers have created tiny pores in single sheets of graphene that have an array of preferences and characteristics similar to those of ion channels in living cells, and which could be useful as sensors. The researchers pointed out that e... » read more

The Week In Review: Design/IoT
By Jesse Allen - 02 Oct, 2015 - Comments: 0

EDA industry revenue increased 8.5% for Q2 2015 to $1906.5 million, according to the latest report from the EDA Consortium. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, also increased by 8.5%. IP showed continued strength, with revenue totalling $611.7 million in Q2 2015, a 15% increase compared to Q2 2014; the four-quarters moving a... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 01 Oct, 2015 - Comments: 1

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to talk about consolidation, Moore's Law, and where the opportunities are in the IoT and automotive markets. What follows are excerpts of that conversation. SE: What are the big concerns for the semiconductor industry in general, and EDA in particular? Tan: Top on my list is all the consolidation that's goin... » read more

Blog Review: Sept. 30
By Jesse Allen - 30 Sep, 2015 - Comments: 0

In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

System Bits: Sept. 29
By Ann Mutschler - 29 Sep, 2015 - Comments: 0

Light detector on a chip for portable sensors The invention by Vanderbilt University and Ohio University researchers of the first integrated circularly polarized light detector on a silicon chip could open the door for development of small, portable sensors to expand the use of polarized light in drug screening, surveillance, optical communications, quantum computing, and other applications. ... » read more

EDA, IP Numbers Up
By Ed Sperling - 28 Sep, 2015 - Comments: 0

EDA and IP numbers increased another 8.5% in Q2, with all regions but Japan showing positive growth. Total revenue was $1.91 billion for the quarter, up from $1.76 billion in Q2 of 2014. The largest category, computer-aided engineering, was $657.2 million for the quarter, up 9.6% compared with the same period last year. IC physical design was $379.2 million, up 6% year over year, and IP was ... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

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