Does SoC Signoff Mean More Than RTL?


As the cost of failure continues to rise, SoC engineers see the growing importance of ensuring their work is as correct as possible as soon as possible in the design process. They cannot afford to carry errors forward from one stage to the next, where their impact grows while their causes become more obscured. This requirement is driving the shift in design exploration and handoff to the reg... » read more

Development of Complex Multicore Systems: Tracing Challenges and Concept


This white paper is the first paper of a two-part Mentor Embedded multicore white paper series. In this paper, the challenges software developers face when developing, debugging, and validating software applications for a complex multicore system will be discussed. The paper also highlights some of the questions around hardware resource usage, tracing aids, tracing domains, and concepts for col... » read more

FinFET Technology


This white paper discusses the major challenges with FinFETs and how TSMC has been collaborating with Synopsys, one of their ecosystem partners, to deliver a complete solution. Key elements of this solution include comprehensive FinFET profiling without impact to design tool runtime and proven, verified IP availability. The TSMC 16-nm FinFET solution will ensure mutual customers swiftly move to... » read more

Executive Briefing: Stacking The Odds


Open-Silicon CEO Naveed Sherwani talks with System-Level Design about progress on 2.5D and 3D stacked die, why this approach is inevitable, when it will begin and what markets will use it first. [youtube vid=mzwpgDKuIok] » read more

IP Play


Cadence Senior Vice President Martin Lund talks about the future of IP, why his company has been on an IP acquisition binge, and the new focus on mass-customization. [youtube vid=FdmBIlXpGVk] » read more

Software-Driven Electronic Design Automation


As the EDA industry prepares to descend on Austin in less than two weeks for the 50th annual Design Automation Conference (DAC), I am wondering what this DAC will be about. It’s pretty simple. One of the key themes will be about “software-driven EDA,” a term I’d love to claim to have invented but am happy to attribute to Jim Ready of Ready Systems and Montavista fame – our chief techn... » read more

Experts At The Table: The Internet Of Everything


By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

Divide, Abstract And Conquer


For years, the motto among design and verification engineers has been to look at the individual pieces of a design because it’s impossible to have a single tool or even an integrated collection of tools that can debug everything. That approach isn’t changing, but the method for getting there is. The driver behind this shift is a familiar one—growing complexity. Even platforms and subsy... » read more

Shifts In Verification


By Ann Steffora Mutschler Verifying an SoC requires a holistic view of the system, and engineering teams use a number of tools to reach a high degree of confidence in the coverage. But how and when to use those tools is in flux as engineering teams wrestle with increasing complexity at every level of the design, and a skyrocketing increase in the challenge of verifying it. There are no ... » read more

Beyond Software: The Virtual-Machine Supply System


It’s no secret that EDA and IP companies have had to expand their coverage into the larger system market, thanks to changes in the semiconductor supply chain. Around 2000, the industry was very fragmented. Mobile-chip and IP vendors worked with handset makers, who then partnered with operating-system (OS) suppliers and finally network operators. The next 12 years resulted in various combinati... » read more

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