Analog Planar Memristor Device: Developing, Designing, and Manufacturing


A new technical paper titled "Analog monolayer SWCNTs-based memristive 2D structure for energy-efficient deep learning in spiking neural networks" was published by researchers at Delft University of Technology and Khalifa University. Abstract: "Advances in materials science and memory devices work in tandem for the evolution of Artificial Intelligence systems. Energy-efficient computation... » read more

Nanoscale Reconfigurable Si Transistors (TU Wien, CNRS, UNC)


A new technical paper titled "Nanoscale Reconfigurable Si Transistors: From Wires to Sheets and Unto Multi-Wire Channels" was published by researchers at TU Wien, CNRS, and University of North Carolina at Chapel Hill. Abstract: "In this work, bottom-up Al–Si–Al nanowire (NW) heterostructures are presented, which act as a prototype vehicle toward top-down fabricated nanosheet (NS) and ... » read more

Memory Devices-Based Bayesian Neural Networks For Edge AI


A new technical paper titled "Bringing uncertainty quantification to the extreme-edge with memristor-based Bayesian neural networks" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Safety-critical sensory applications, like medical diagnosis, demand accurate decisions from limited, noisy data. Bayesian neural networks excel at such tasks, offering... » read more

FeFET Memory Encrypted Inside The Storage Array


A new technical paper titled "Embedding security into ferroelectric FET array via in situ memory operation" was published by researchers at Pennsylvania State University, University of Notre Dame, Fraunhofer IPMS, National University of Singapore, and North Dakota State University. Abstract "Non-volatile memories (NVMs) have the potential to reshape next-generation memory systems because of... » read more

Forward Body Biasing in Bulk Cryo-CMOS With Negligible Leakage (TU Delft)


A new technical paper titled "Cryogenic-Aware Forward Body Biasing in Bulk CMOS" was published by researchers at QuTech, Tu Delft. Abstract "Cryogenic CMOS (cryo-CMOS) circuits are often hindered by the cryogenic threshold-voltage increase. To mitigate such an increase, a forward body biasing (FBB) technique in bulk CMOS is proposed, which can operate up to the nominal supply without prob... » read more

Hardware-Based Methodology To Protect AI Accelerators


A technical paper titled “A Unified Hardware-based Threat Detector for AI Accelerators” was published by researchers at Nanyang Technological University and Tsinghua University. Abstract: "The proliferation of AI technology gives rise to a variety of security threats, which significantly compromise the confidentiality and integrity of AI models and applications. Existing software-based so... » read more

A Survey Of Recent Advances In Spiking Neural Networks From Algorithms To HW Acceleration


A technical paper titled “Recent Advances in Scalable Energy-Efficient and Trustworthy Spiking Neural networks: from Algorithms to Technology” was published by researchers at Intel Labs, University of California Santa Cruz, University of Wisconsin-Madison, and University of Southern California. Abstract: "Neuromorphic computing and, in particular, spiking neural networks (SNNs) have becom... » read more

Dual Instruction-Set Architecture, Supporting A TTA And RISC-V Instruction Set Via a Lightweight Microcode Hardware Unit


A technical paper titled “Energy-Efficient Exposed Datapath Architecture With a RISC-V Instruction Set Mode” was published by researchers at Tampere University. Abstract: "Transport triggered architectures (TTAs) follow the static programming model of very long instruction word (VLIW) processors but expose additional information of the processor datapath in the programming interface, whic... » read more

A Framework For Improving Current Defect Inspection Techniques For Advanced Nodes


A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at Ghent University, imec, and SCREEN SPE. Abstract: "In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent ... » read more

More Efficient Side-Channel Analysis By Applying Two Deep Feature Loss Functions


A technical paper titled “Beyond the Last Layer: Deep Feature Loss Functions in Side-channel Analysis” was published by researchers at Nanyang Technological University, Radboud University, and Delft University of Technology. Abstract: "This paper provides a novel perspective on improving the efficiency of side-channel analysis by applying two deep feature loss functions: Soft Nearest Neig... » read more

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