category: Top Stories

category: Auto, Security & Edge AI

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing
By Anne Meixner - 09 Dec, 2025 - Comments: 0

Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

AI In Test Analytics: Promise Vs. Reality
By Gregory Haley - 11 Nov, 2025 - Comments: 0

The semiconductor industry is increasingly turning to artificial intelligence as the solution for increasing complexity in test analytics, hoping algorithms can tame the growing flood of production data. The need to extract actionable insight from that torrent is pressing. AI/ML (AI) models promise to find correlations buried in multidimensional datasets, predict failures before they occur, and... » read more

New Rules Put The Squeeze On Semiconductor Gray Market
By Anne Meixner - 11 Nov, 2025 - Comments: 0

The shift toward chiplets and multi-die assemblies is forcing big changes in the global supply chain, including much tighter cooperation between companies and governments to ensure the authenticity and quality of semiconductor parts. The chip industry has been looking to digital certificates as the best means of reducing counterfeiting and ensuring consistent quality for some time. The probl... » read more

HBM Leads The Way To Defect-Free Bumps
By Laura Peters - 11 Nov, 2025 - Comments: 0

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and foundries must simultaneously handle multi-layer chip stacking, die warpage, and shorter product lifecycles that are shrinking from two years down to just one. But perhaps the most formidable c... » read more

New Frontiers In Fault Detection And Classification
By Laura Peters - 14 Oct, 2025 - Comments: 0

IC manufacturers are increasingly relying on intelligent data processing to prevent downtime, improve yields, and reduce scrap. They are integrating that with fault detection and classification (FDC) to trace faults to their cause. Today’s FDC systems feature better sensors, variability control, and both predictive and prescriptive modeling. In the future, FDC will enable real-time decisio... » read more

Metrology’s Growing Role In Reducing False Defects
By Gregory Haley - 14 Oct, 2025 - Comments: 0

When a good die fails test and gets scrapped, often no one notices, because false failures look identical to real ones. Yet across the industry, these phantom defects are quietly eroding yield, inflating test costs, and masking the true health of manufacturing processes. At advanced nodes and in heterogeneous packaging, where margins are already razor-thin, even minor variations in contact r... » read more

Hybrid Approach Emerges For Edge/Cloud Inspection Of Chips
By Anne Meixner - 14 Oct, 2025 - Comments: 0

An explosion in data from inspection images and metrology measurements is creating a confusing set of demands for chipmakers and their equipment vendors. On one hand they need the massive storage and compute resources of the cloud to utilize AI/ML-based models, but they also need the faster response time of the edge to make adjustments at the tool level. Balancing these requirements is a mas... » read more

Making The Most of Test Resources
By Laura Peters - 09 Sep, 2025 - Comments: 0

Semiconductor testing is undergoing multiple paradigm changes at once with the common goals of producing more known good die per month with low test cost. Achieving these goals requires a delicate balance between yield, quality, and test times. There are multiple ways to go about making better use of existing resources, many of which involve an increasing use of design for test (DFT) methods... » read more

The Hidden Cost Of Contact Resistance
By Gregory Haley - 09 Sep, 2025 - Comments: 1

Contact resistance, or CRES, is one of those problems that most engineers prefer not to think about until it's staring them in the face. For years, it could be managed quietly with routine probe card cleaning or a scheduled socket swap. That approach worked well enough when pin counts were lower and devices pulled less current, but the ground has shifted since then. Today’s AI processors m... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

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