category: Top Stories

category: Auto, Security & Edge AI

IP Integration Challenges Rising
By Ann Mutschler - 24 Jul, 2014 - Comments: 0

It’s not just [getkc id="80" comment="lithography"] that is putting a crimp in sub-28nm designs. As more functions, features, transistors and software are added onto chips, the pressure to get chips out the door has forced chipmakers to lean more heavily on third-party IP providers. Results, as you might expect, have been mixed. The number of blocks has mushroomed, creating its own web of ... » read more

EDA’s Hedge Plays
By Ed Sperling - 24 Jul, 2014 - Comments: 0

While 14/16nm process technologies with finFETs and double patterning have pushed complexity to new heights, the move to 10nm fundamentally will change a number of very basic elements of the design through manufacturing flow—and EDA vendors will be caught in the middle of having to make hard choices between foundries, processes, packaging approaches, and potentially which markets to serve. ... » read more

New Winners And Losers
By Brian Bailey - 24 Jul, 2014 - Comments: 0

During DAC 2013, Robert Colwell of DARPA said he was attempting to prepare the U.S. Dept. of Defense for what he believes is the cataclysm caused by the end of [getkc id="74" comment="Moore's Law"]. He asked the question, “What happens when we don’t have a new technology that doubles the number of transistors every couple of years?” Colwell believes that power is the primary reason why... » read more

High-Level Gaps Emerge
By Ann Mutschler - 24 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow, and why it is needed at present with Leah Clark, associate technical director for digital video technology at Broadcom; Jon McDonald, technical marketing engineer at Mentor Graphics; Phil Bishop, vice president of the System Level Design System & Verification Group at Cadence; and Bernard Mu... » read more

Foundries Versus OSATs
By Ed Sperling - 24 Jul, 2014 - Comments: 2

Since the 1990s, commercial foundries have ruled semiconductor manufacturing while the [getkc id='83' comment='OSAT'] providers (OSATs) have dominated IC packaging and testing. But as the industry moves toward stacked die over the next couple of years, and big foundries see a chance to expand their reach, the stage is set for an all-out war. There is much at stake on both sides. Foundries g... » read more

Reversing Course, With A Twist
By Brian Bailey - 24 Jul, 2014 - Comments: 1

Semiconductor Engineering is running an extended series of articles that examine the assertion that the end of Moore’s Law will have profound implications for the entire semiconductor, EDA and IP industries. Part one of this article, which focuses on the EDA industry, addressed the question about who was going to pay for future development of EDA tools for the latest production nodes. The ind... » read more

Executive Insight: Satish Bagalkotkar
By Ed Sperling - 23 Jul, 2014 - Comments: 1

Semiconductor Engineering sat down with Satish Bagalkotkar, president and CEO of design services company Synapse Design to talk about massive shifts in the semiconductor industry and his vision of how these changes will alter the landscape, from chipmakers to design services to what gets built and how it will get used. What follows are excerpts of that interview. SE: What worries you most? ... » read more

Where Do We Stand With CDC?
By Ann Mutschler - 18 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss where the industry stands on clock domain crossing with Charlie Janac, CEO of Arteris; Shaker Sarwary, VP of Formal Verification Products at Atrenta; Pranav Ashar, CTO at Real Intent; and Namit Gupta, CAE, Verification Group at Synopsys. What follows are excerpts of that conversation. SE: What are the biggest use models for CDC verification today... » read more

Moore’s Law Tail No Longer Wagging The Dog
By Brian Bailey - 26 Jun, 2014 - Comments: 3

In a recent special report titled “Will 7nm and 5nm really happen?” Semiconductor Engineering outlined the progress being made for new production nodes and the progress being made to overcome the technological challenges that they contain. But who are the likely candidates for those new nodes and who is going to pay for their development, including the EDA tools that will be necessary to ut... » read more

Asynchronous Is Mostly Academic
By Ann Mutschler - 26 Jun, 2014 - Comments: 4

There are a number of interesting technologies to keep an eye on in term of how and when they could be adopted for use in SoC design today, some of which include gallium arsenide, GPGPUs, 3D ICs and asynchronous logic. Asynchronous logic promises a number of benefits in some specific application areas, and one that buoys to the surface for potential near-term use is in the area of security a... » read more

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