category: Top Stories

category: Auto, Security & Edge AI

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Better Analytics Needed For Assembly
By Anne Meixner - 11 Aug, 2020 - Comments: 0

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

5G Brings New Testing Challenges
By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

Auto Chip Reliability Opens Door To Other Industries
By SE Staff - 11 Aug, 2020 - Comments: 1

Digital chips in the semiconductor industry evolve from each other. Ideas flow into each other over the years, with occasional big leaps in evolution. The term ‘evolution’ fits because one chip evolves to perfectly optimized for one industry niche. But what happens when one industry’s chip becomes a useful for other industries because it is more cost-effective than what is being used i... » read more

Customization And Limitations At The Edge
By Ed Sperling - 10 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the edge constraints and the need for security with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of... » read more

Virtualization In The Car
By Ann Mutschler - 06 Aug, 2020 - Comments: 1

As the automotive industry grapples with complexity due to electrification and increasing autonomy of vehicles, consolidation of ECUs within vehicles, more stringent safety and security requirements, automotive ecosystem players are looking to virtualization concepts in a number of ways to realize the vehicles of tomorrow. One way is with hardware virtualization; the ability of a device such... » read more

WiFi Evolves For The IoT
By Bryon Moyer - 06 Aug, 2020 - Comments: 0

WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

Big Changes In AI Design
By SE Staff - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Problems And Solutions In Analog Design
By Ann Mutschler - 05 Aug, 2020 - Comments: 1

Advanced chip design is becoming a great equalizer for analog and digital at each new node. Analog IP has more digital circuitry, and digital designs are more susceptible to kinds of noise and signal disruption that have plagued analog designs for years. This is making the design, test and packaging of SoCs much more complicated. Analog components cause the most chip production test failures... » read more

Startup Funding: July 2020
By Jesse Allen - 05 Aug, 2020 - Comments: 0

A number of semiconductor and design companies took in funding this month, from a mega round for a data center switch maker to seed grants for two Canadian companies and new funding for an IP marketplace. China continues to be a hot area for electric vehicles, with one company raising half a billion for its two models currently in production. For July, we highlight fifteen startups that raised ... » read more

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