category: Top Stories

category: Auto, Security & Edge AI

Creating Better Models For Software And Hardware Verification
By Ed Sperling - 04 Aug, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss what's ahead for verification with Daniel Schostak, Arm fellow and verification architect; Ty Garibay, vice president of hardware engineering at Mythic; Balachandran Rajendran, CTO at Dell EMC; Saad Godil, director of applied deep learning research at Nvidia; Nasr Ullah, senior director of performance architecture at SiFive. What follows are excerpt... » read more

The Evolution Of Digital Twins
By Brian Bailey - 03 Aug, 2020 - Comments: 1

Digital twins are starting to make inroads earlier in the chip design flow, allowing design teams to develop more effective models. But they also are adding new challenges in maintaining those models throughout a chip's lifecycle. Until a couple of years ago, few people in the semiconductor industry had even heard the term "digital twin." Then, suddenly, it was everywhere, causing confusion ... » read more

Pivoting Toward Safety-Critical Verification In Cars
By Ann Mutschler - 31 Jul, 2020 - Comments: 1

The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Universal Verification Methodology Running Out Of Steam
By Ann Mutschler - 30 Jul, 2020 - Comments: 2

For the past decade or so, the Universal Verification Methodology (UVM) has been the de facto verification methodology supported by the entire EDA industry. But as chips become more heterogeneous, more complex, and significantly larger, UVM is running out of steam. Consensus is building that some fundamental changes are required, moving tools up a level of abstraction and making them more ag... » read more

Open-Source Verification
By Brian Bailey - 30 Jul, 2020 - Comments: 1

Ask different people what open-source verification means and you will get a host of different answers. They range from the verification of open-source hardware, to providing an open-source verification infrastructure, to providing open-source stream generators or reference models, to open-source simulators and formal verification engines. Verification is about reducing risk. "Verification is... » read more

RISC-V Gaining Traction
By Ed Sperling - 30 Jul, 2020 - Comments: 0

Part 1: Semiconductor Engineering sat down to discuss where and why RISC-V is doing well, with Zdenek Prikryl, CTO of Codasip; Helena Handschuh, a Rambus Security Technologies fellow; Louie De Luna, director of marketing at Aldec; Shubhodeep Roy Choudhury, CEO of Valtrix Systems; and Bipul Talukdar, North America director of applications engineering at SmartDV. What follows are excerpt of that ... » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Challenges For A Post-Moore’s Law World
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

EDA On Board With New Package Options
By Ann Mutschler - 22 Jul, 2020 - Comments: 2

A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

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