category: Top Stories

category: Auto, Security & Edge AI

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Auto Chip Test Issues Grow
By Jeff Dorsch - 08 Jan, 2018 - Comments: 0

By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Getting Serious About Chiplets
By Ann Mutschler - 08 Jan, 2018 - Comments: 0

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Reshaping Automotive Design
By Ann Mutschler - 04 Jan, 2018 - Comments: 0

The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

Blockchain: Hype, Reality, Opportunities
By Susan Breidenbach - 04 Jan, 2018 - Comments: 4

Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

Who’s Responsible For Security?
By Ed Sperling - 04 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss security issues and how to fix them with Mark Schaeffer, senior product marketing manager for secure solutions at Renesas Electronics; Haydn Povey, CTO of Secure Thingz; Marc Canel, vice president of security systems and technologies at [getentity id="22186" comment="Arm"]; Richard Hayton, CTO of Trustonic; Anders Holmberg, director of corporate dev... » read more

Mixed-Signal Issues Worse At 10/7nm
By Ann Mutschler - 03 Jan, 2018 - Comments: 1

Despite increasingly difficulty in scaling digital logic to 10/7nm, not all designs at the leading edge are digital. In fact, there are mixed-signal components in designs at almost all nodes down to 10/7nm. This may seem surprising because analog scaling has been an issue since about 90nm, but these are not traditional analog components. Analog IP increasingly includes highly integrated, mix... » read more

Reflection On 2017: Design And EDA
By Brian Bailey - 03 Jan, 2018 - Comments: 0

People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. We see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but most have this year. (Part one looked at the predictions associated with s... » read more

A New Memory Contender?
By Mark LaPedus - 02 Jan, 2018 - Comments: 1

Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

Which Verification Engine?
By Ed Sperling - 02 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the state of verification with Jean-Marie Brunet, senior director of marketing for emulation at [getentity id="22017" e_name="Mentor, a Siemens Business"]; Frank Schirrmeister, senior group director for product management at [getentity id="22032" e_name="Cadence"]; Dave Kelf, vice president of marketing at [getentity id="22395" e_name="OneSpin Solut... » read more

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