Integrated Photonics (Part 1)


Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Tools To Design CNNs


Convolutional neural networks are becoming a mainstay in machine learning and artificial intelligence, allowing a network of distributed sensors to collect data and send them to a central brain for processing. This is a relatively simple idea in comparison to today's technology, and the idea of the [getkc id="261" kc_name="convolutional neural network"] has been around for some time. But bui... » read more

What’s New At Hot Chips


By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

Portable Stimulus Status Report


The first release of the Portable Stimulus (PS) standard is slated for early next year. If it lives up to its promise, it could be the first new language and abstraction for verification in two decades. [getentity id="22028" e_name="Accellera"] uncorked the PS Early Adopter release at the Design Automation Conference (DAC) in June. The standard has been more than two years in the making by t... » read more

Executive Insight: Aart de Geus


Aart de Geus, chairman and co-CEO of [getentity id="22035" e_name="Synopsys"], sat down with Semiconductor Engineering to discuss machine learning and big data, the race toward autonomous vehicles, systems vs. chips, software vs. hardware, and the future of EDA. What follows are excerpts of that conversation. SE: The whole tech world is buzzing over data and how it gets used in areas such as... » read more

When Is Verification Complete?


Deciding when verification is done is becoming a much more difficult decision, prompting verification teams to increasingly rely on metrics rather than just the tests listed in the verification plan. This trend has been underway for the past couple of process nodes, but it takes time to spot trends and determine whether they are real or just aberrations. The Wilson Research Group conducts a ... » read more

Four Foundries Back MRAM


Four major foundries plan to offer MRAM as an embedded memory solution by this year or next, setting the stage for what finally could prove to be a game-changer for this next-generation memory technology. GlobalFoundries, Samsung, TSMC and UMC plan to start offering spin-transfer torque magnetoresistive RAM (ST-MRAM or STT-MRAM) as an alternative or a replacement to NOR flash, possibly start... » read more

The 200mm Equipment Scramble


An explosion in 200mm demand has set off a frenzied search for used semiconductor manufacturing equipment that can be used at older process nodes. The problem is there is not enough used equipment available, and not all of the new or expanding 200mm fabs can afford to pay the premium for refurbished or new equipment. This may sound like a straightforward supply and demand issue, but behind t... » read more

IP Biz Changes As Markets Fragment


Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of [getentity id="22203" e_name="ClioSoft"]; Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of product marketing for [getentity id="22032" e_name="Cadence"]'s IP Group; and John Koeter, vice president of marketing for [getentity id="22035" e_name="Synopsys"]' S... » read more

Why Fabs Worry About Tool Parts


Achieving high yields with acceptable costs is becoming much more difficult as chipmakers migrate to next-generation 3D NAND and finFET devices—but not just because of rising complexity or lithography issues. To fabricate an advanced logic chip, for example, a wafer moves from one piece of equipment to another in what amounts to 1,000 process steps or more in a fab. Any glitch with the equ... » read more

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