Bridging Hardware And Software


Since the advent of embedded systems there has been a struggle between hardware engineers trying to understand the mindset of their software counterparts, and vice versa. That struggle is alive and well today—and it's costing everyone money. This divide is rife with passion, territoriality and misunderstanding. It has delayed tapeouts, created errors and inefficiencies that take time and e... » read more

Why Test Is Changing


Test is undergoing a revolution in terms of how it is perceived, how it is performed and where it is done. For years, test was something of an afterthought. It was a separate operation that was done after the design was finished, or it was a self-contained module that had to be characterized for power, heat and electrical effects, but not much else. As more chips find their way into markets ... » read more

Reflections On 2015


It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with SemiEngineering. We like to hold people's feet to the fire, but while the Pants-On-Fire meter may be applicable to politicians, we like to thin... » read more

Who’s Profiting From Complexity


Tool vendors' profits increasingly are coming from segments that performed relatively poorly in the past, reflecting both a rise in complexity in designing chips and big improvements in the tools themselves. The impacts of power, memory congestion, advanced-node effects such as process variation, [getkc id="160" kc_name="electromigration"] and RC delay in [getkc id="36" kc_name="interconnect... » read more

Inside Inspection And Metrology


Semiconductor Engineering sat down to talk about inspection, metrology and other issues with Mehdi Vaez-Iravani, vice president of advanced imaging technologies at Applied Materials. What follows are excerpts of that conversation. SE: Today, the industry is working on a new range of complex architectures, such as 3D NAND and finFETs. For these technologies, the industry is clearly struggling... » read more

Fab Tool Biz Looks Cloudy


Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

Rise Of The Old Fab


Growth in the [getkc id="260" comment="Internet of Everything"], along with the beginning of a shift toward systems in package, are creating buzz in a rather unlikely place—established and well-worn process nodes where equipment is scarce, semi-functional, and difficult to maintain. In the past, moving to the next node was a sign of progress, leaving behind the trailing edge of designs to ... » read more

What’s Next In Mobile Displays


The next wave of smartphones and wearables is invading the market. These systems will feature a new class of high-resolution displays, and in the near future displays will become foldable and rollable, although there are still some challenges with this technology. To be sure, mobile display technology is advancing on several fronts. On one front, for example, Apple and other systems vendor... » read more

Foundries Face Challenges in 2016


Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

The Next Resists…Continued


As previously discussed, conventional chemically-amplified resists are struggling to balance the competing requirements of EUV lithography. Simultaneously meeting the industry’s targets for resolution, sensitivity, and line-edge roughness may require new resist concepts. Inpria’s resist technology, based on tin-oxide nano clusters, is one possibility. Recently published work at SUNY Albany ... » read more

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