What Can You Trust In The IoT?


Most of us on the bleeding edge of technology are aware that the Internet of Things/Everything and the Cloud of Things (IoT/E), (CoT), are slowly becoming less fuzzy. No one knows exactly what the model ultimately will look like, but it is becoming clearer and clearer that it won’t be radically different than the Internet we have today—just more objects, more interconnects, more autonomy, a... » read more

Designing For Security


Some level of security is required in SoC today, whether it is in hardware, software or — most commonly — both. Of course, there is a price to pay from a power and performance perspective, but thankfully just a small one in most cases. The explosion of consumer devices has driven the need for increased security features in smart cards, smart phones, personal computers, home networks, and... » read more

Why Every Chip Can Be Hacked With This Tool


As explained by Darth Vader in the classic Star Wars saga, the line between good and evil can be very thin. What is sometimes developed for the benefit technology, in the hands of the wrong people, can be devastating. That may seem a bit melodramatic when it comes to discussions around focused ion beam (FIB) applications in semiconductors, but the analogy is quite real. Focused ion beam tec... » read more

Defending Against Reverse Engineering


Most of us are familiar with the term “reverse engineering.” We generally know that it is used to extract data or designs from chips, but exactly how is pretty much a mystery. Today, chip security has very broad implications. The landscape of tomorrow will be cluttered with devices that are microprocessor-controlled, including some that are autonomous. Numbers vary, but the current esti... » read more

White Hat Hacking


At first glance, the words “reverse engineering” (RE) might conjure up a couple of nefarious individuals with table full of tools, meters, and the like, in some basement trying to figure out how to disassemble some sort of electronic device. The image is wrong, however. More likely, today’s RE work will be found in a clandestine, well-funded uber-laboratory in an up-and-coming third-wo... » read more

EUV Is Key To 450mm Wafers


Whether the wafers in question are 200 mm in diameter, or 300 mm, or potentially 450 mm, larger wafer sizes have always been justified by manufacturing economics. If the cost to process a wafer stays the same, but the wafer contains more devices, then the cost per device goes down. For processes that apply to the entire wafer at once — etch, deposition, cleaning, and so forth — the equation... » read more

IP And FinFETs At Advanced Nodes


Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics, and Bernard Murphy, CTO of Atrenta. What follows are excerpts of that conversation. SE: It’s harder for a fabless semiconductor ... » read more

IP Integration Challenges Rising


It’s not just [getkc id="80" comment="lithography"] that is putting a crimp in sub-28nm designs. As more functions, features, transistors and software are added onto chips, the pressure to get chips out the door has forced chipmakers to lean more heavily on third-party IP providers. Results, as you might expect, have been mixed. The number of blocks has mushroomed, creating its own web of ... » read more

EDA’s Hedge Plays


While 14/16nm process technologies with finFETs and double patterning have pushed complexity to new heights, the move to 10nm fundamentally will change a number of very basic elements of the design through manufacturing flow—and EDA vendors will be caught in the middle of having to make hard choices between foundries, processes, packaging approaches, and potentially which markets to serve. ... » read more

New Winners And Losers


During DAC 2013, Robert Colwell of DARPA said he was attempting to prepare the U.S. Dept. of Defense for what he believes is the cataclysm caused by the end of [getkc id="74" comment="Moore's Law"]. He asked the question, “What happens when we don’t have a new technology that doubles the number of transistors every couple of years?” Colwell believes that power is the primary reason why... » read more

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