category: Top Stories

category: Auto, Security & Edge AI

High-Level Gaps Emerge
By Ann Mutschler - 24 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow, and why it is needed at present with Leah Clark, associate technical director for digital video technology at Broadcom; Jon McDonald, technical marketing engineer at Mentor Graphics; Phil Bishop, vice president of the System Level Design System & Verification Group at Cadence; and Bernard Mu... » read more

Foundries Versus OSATs
By Ed Sperling - 24 Jul, 2014 - Comments: 2

Since the 1990s, commercial foundries have ruled semiconductor manufacturing while the [getkc id='83' comment='OSAT'] providers (OSATs) have dominated IC packaging and testing. But as the industry moves toward stacked die over the next couple of years, and big foundries see a chance to expand their reach, the stage is set for an all-out war. There is much at stake on both sides. Foundries g... » read more

Reversing Course, With A Twist
By Brian Bailey - 24 Jul, 2014 - Comments: 1

Semiconductor Engineering is running an extended series of articles that examine the assertion that the end of Moore’s Law will have profound implications for the entire semiconductor, EDA and IP industries. Part one of this article, which focuses on the EDA industry, addressed the question about who was going to pay for future development of EDA tools for the latest production nodes. The ind... » read more

Executive Insight: Satish Bagalkotkar
By Ed Sperling - 23 Jul, 2014 - Comments: 1

Semiconductor Engineering sat down with Satish Bagalkotkar, president and CEO of design services company Synapse Design to talk about massive shifts in the semiconductor industry and his vision of how these changes will alter the landscape, from chipmakers to design services to what gets built and how it will get used. What follows are excerpts of that interview. SE: What worries you most? ... » read more

IP And FinFETs At Advanced Nodes
By Ed Sperling - 21 Jul, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics, and Bernard Murphy, CTO of Atrenta;. What follows are excerpts of that conversation. SE: What happens with the next revs of finFET... » read more

Executive Insight: Ajoy Bose
By Ed Sperling - 21 Jul, 2014 - Comments: 1

SE: What keeps you awake at night? Bose: What I worry about more than anything else is the need for us (at Atrenta) to show growth on an ongoing basis. A company’s challenges change with the lifecycle of that company. In the early days you worry about survival and trying to establish yourself in the industry. Fortunately, Atrenta is a bigger company today, so the nature of the concerns has c... » read more

Where Do We Stand With CDC?
By Ann Mutschler - 18 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss where the industry stands on clock domain crossing with Charlie Janac, CEO of Arteris; Shaker Sarwary, VP of Formal Verification Products at Atrenta; Pranav Ashar, CTO at Real Intent; and Namit Gupta, CAE, Verification Group at Synopsys. What follows are excerpts of that conversation. SE: What are the biggest use models for CDC verification today... » read more

1-on-1 With Intel’s Foundry Chief
By Mark LaPedus - 17 Jul, 2014 - Comments: 1

By Mark LaPedus & Ed Sperling Semiconductor Engineering sat down to discuss foundry trends, IC scaling, chip-packaging and other topics with Sunit Rikhi, vice president of the Technology and Manufacturing Group at Intel and general manager of Intel’s Custom Foundry unit. SE: Where is Intel at in the foundry business today? Rikhi: We started with a very narrow set of customers. Now, we... » read more

The Uncertain Future Of Hard Drives
By Michael Watts - 17 Jul, 2014 - Comments: 0

The future of hard drives has been an iffy subject for nearly a decade. The most recent pressure has come from solid-state drives made from flash memory, which have transformed cell phones and tablets and other portable appliances. But the Internet has driven a staggering demand for data storage and the hard drive business has thrived. The question of what’s next for hard drives first appe... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy