category: Top Stories

category: Auto, Security & Edge AI

Power Becomes Bigger Issue In Stacked Die
By Ed Sperling - 10 May, 2013 - Comments: 0

By Ed Sperling Concern over getting the heat out of stacked die is well defined, even if the current raft of existing and proposed solutions ranges from ineffective to exotic and expensive. What is less well understood is how to plan for and manage power inside of stacked die. While power and heat frequently go hand in hand—where there is heat there is almost always power dissipation—t... » read more

Bringing Electrical Info To Design’s Forefront
By Ann Mutschler - 09 May, 2013 - Comments: 0

By Ann Steffora Mutschler To reflect the impact on transistors of smaller process nodes and the electrical effects that occur as a result, a shift is underway where the electrical analysis and verification that used to be done when the layout was complete is moving earlier in the design process. The analysis includes parasitic extraction of interconnect and device parasitics, electromigrati... » read more

Executive Briefing: Andrew Yang
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ed Sperling Andrew Yang, president of ANSYS subsidiary Apache Design, sat down with Low-Power/High-Performance Engineering to talk about why power is becoming so important and where the future challenges lie. What follows are excerpts of that conversation. LPHP: What’s the most important issue these days for chipmakers? Yang: According to the feedback we’ve gotten from our customer... » read more

What’s Missing In Low-Power Verification
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ed Sperling Ask two engineers what low-power verification is and you’ll likely get the same checklist that includes confidence in the overall design, good coverage, a long list of corner cases, and other items in a checklist. Ask them how to reach that goal you’ll almost certainly get different answers—or maybe no answers at all. Power has emerged as a ubiquitous concern in design,... » read more

Lessons Learned In 4G LTE
By Ann Mutschler - 09 May, 2013 - Comments: 0

By Ann Steffora Mutschler While 4G LTE has moved into the mainstream, there are lessons to be learned about these very complex modems, especially from the perspective of balancing power and performance. The road to mainstream wasn’t exactly smooth sailing. “4G LTE initially got a bad rap for battery life, for power consumption,” said Pete Hardee, low-power design solution marketin... » read more

Shades Of Green
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ann Steffora Mutschler Ask five people in the electronics industry what ‘green’ means and you are sure to get five different answers. In the datacenter, the definition is a little clearer because big iron draws so many amps. But at the SoC level where does the industry stand? The answer is as multifaceted as an SoC itself, with some answers based more on one-upmanship than real met... » read more

Experts At The Table: Issues In Metrology And Inspection
By Mark LaPedus - 29 Apr, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future metrology and inspection challenges with John Allgair, senior member of the technical staff at GlobalFoundries; Kevin Heidrich, vice president of marketing and business development at Nanometrics; Robert Newcomb, executive vice president at Qcept Technologies; and Shrinivas Shetty, vice president of marketing f... » read more

Shifts In Verification
By Ed Sperling - 25 Apr, 2013 - Comments: 0

By Ann Steffora Mutschler Verifying an SoC requires a holistic view of the system, and engineering teams use a number of tools to reach a high degree of confidence in the coverage. But how and when to use those tools is in flux as engineering teams wrestle with increasing complexity at every level of the design, and a skyrocketing increase in the challenge of verifying it. There are no ... » read more

Beyond Software: The Virtual-Machine Supply System
By The SE Staff - 25 Apr, 2013 - Comments: 0

It’s no secret that EDA and IP companies have had to expand their coverage into the larger system market, thanks to changes in the semiconductor supply chain. Around 2000, the industry was very fragmented. Mobile-chip and IP vendors worked with handset makers, who then partnered with operating-system (OS) suppliers and finally network operators. The next 12 years resulted in various combinati... » read more

Taking Aim At Big Data
By Ed Sperling - 25 Apr, 2013 - Comments: 0

By Ed Sperling As the Internet of Things bridges the gap between the mobile and big data worlds, EDA and IP vendors increasingly are looking well beyond their usual boundaries. How successful they are at moving upward into a market that is far less price-sensitive remains to be seen. But from a technology standpoint, at least, the issues encountered by data centers and cloud providers are ... » read more

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