category: Whitepapers

category: IoT, Security & Automotive

Matter Security And Privacy Fundamentals
By Infineon - 03 Aug, 2022 - Comments: 0

As the Internet of things (IoT) connects more devices and systems, cyberattacks increase. This situation drives concern and hesitation by users and limiting adoption. To address these obstacles, Matter was created with security and privacy as key design tenets. This CSA whitepaper walks through: Security concepts for the smart home Smart home cybersecurity challenges and risks Matter... » read more

Understanding Linear Regulators and their Key Performance Parameters
By Renesas - 27 Jul, 2022 - Comments: 0

Low-dropout regulators, commonly known as LDOs, are used extensively in a wide variety of electronic applications across many different industries. An LDO is generally perceived as a simple and inexpensive way to regulate and control an output voltage that is delivered from a higher input voltage supply. However, cost and simplicity are not the only reason for their widespread use. In fact, tod... » read more

Best Practices For Visibility Architecture Tap Planning
By Keysight - 27 Jul, 2022 - Comments: 0

When it comes to data monitoring, ensuring proper access to network data is one of the most critical things you can do. Missing and incorrect data will slow down the analysis of problems by your security monitoring and tools. It may also lead to false conclusions by those tools. In turn, this can lead to missed security threats, false positives for security threats and network impairments, and ... » read more

Microstrip Antenna Design
By Cadence - 27 Jul, 2022 - Comments: 0

A significant performance element in communication and radar systems, as well as wireless devices, is the antenna, which may be defined as a transducer between a guided electromagnetic (EM) wave propagating along a transmission line, and an EM wave propagating in an unbounded medium (usually free space) or vice-versa.1 The antenna is required to transmit or receive EM energy with directional an... » read more

Custom Compiler Technology Highlights from 2022.06 Release
By Synopsys - 27 Jul, 2022 - Comments: 0

Weikai Sun, VP of Engineering at Synopsys, highlights the key technologies in Custom Compiler’s latest release. He shows how Synopsys’ innovative solutions for design closure, layout automation and emerging applications are increasing the productivity of design teams. Click here to access the  video white paper. » read more

Enabling The 5G RF Front-End Module Evolution With The DSMBGA Package
By Amkor - 21 Jul, 2022 - Comments: 0

The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, together with conformal and compartmental shielding and in-line RF testing, delivers integration levels in a small form factor with high yield. In addition to formidable SiP capacity and DSMBGA techno... » read more

Suppressing Stochastic Interaction To Improve EUV Lithography
By Brewer Science - 21 Jul, 2022 - Comments: 0

Authors Zhimin Zhu Sr., Joyce Lowes, Shawn Ye, Zhiqiang Fan, and Tim Limmer of Brewer Science, Inc. (United States) used Stochastic Area Thickness (SAT) and Dynamic Stochastic Area Thickness (DSAT) to evaluate the stochastic interactions. High optical foot exposure is proposed instead of conventional low substrate reflectivity to reduce SAT. Adhesion control by acid/quencher loading is proposed... » read more

U.S. Chip Packaging With Mil-Spec Precision
By QP Technologies - 21 Jul, 2022 - Comments: 0

Download this white paper to learn: How you can transform your plastic package dummies, test rejects, and excess inventory into ready-to-assemble components The value of an onshore solution for navigating around ITAR supply constraints The benefits from producing chip prototypes that are mechanically and electrically identical to future molded production parts Why Open-Cavity Plas... » read more

Machine Learning Application For Early Power Analysis Accuracy Improvement
By Siemens EDA - 19 Jul, 2022 - Comments: 0

In this paper, we introduce a machine learning (ML) application that accurately estimates the switching power of the cells without needing the SPEF file (SPEF less PA flow). Three ML models (multi-linear regression, random forest and decision tree) were trained and tested on different industrial designs at 7nm technology. They are trained using different cells’ properties available, SPEF, and... » read more

Thermally Optimizing A High-Power PCB
By Cadence - 18 Jul, 2022 - Comments: 0

The growth of battery-powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This white paper illustrates a thermally aware workflow with the Cadence® Celsius™ Thermal Solver... » read more

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