CPO reduces electrical loss, improves energy efficiency and reach, and enables bandwidth densities that are increasingly difficult to achieve with copper alone.
As bandwidth scales to 800G and 1.6T, electrical interconnects and pluggable optics reach limits in power, distance, and signal integrity. Co‑packaged optics (CPO) addresses these challenges by moving optical interconnect closer to silicon, reducing electrical path length, lowering power per bit, and enabling higher bandwidth density. This white paper explains why CPO is emerging now, how it is implemented, the key technical challenges, and how Synopsys enables adoption through silicon‑proven interface IP and EDA solutions.
What You’ll Learn
Read more here.
Fig.1: Synopsys Multiphysics solution, including thermal, optical, electrical, and mechanical analysis, for co-packaged optics designs
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